Flexible Semiconductor Package for Curved Displays
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Solution Overview
Problem
Display driver ICs lack flexibility, making direct attachment to flexible displays challenging, which affects the performance and durability of flexible display devices.
Innovation Solution
A semiconductor package is developed with a semiconductor chip attached to a curved flexible film, featuring a flexible cover layer and underfill material, both made from non-conductive silicon-based materials with conductive filler materials, to enhance adhesion and flexibility, allowing the package to be securely attached to both rigid and curved display panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid semiconductor chip is directly attached to a flexible display panel, then the electrical connection and structural stability are improved, but the flexibility and bendability of the display are deteriorated
Solution Approach 1:
The patent applies this principle by using a flexible film as the substrate for the semiconductor package. The flexible film can be bent and deformed without breaking, allowing the package to adapt to curved or flexible display panels while maintaining electrical connections through the flexible circuit board structure.
Solution Approach 2:
The patent uses composite materials by combining rigid semiconductor chips with flexible substrates and underfill materials. This composite structure allows the package to exhibit both the electrical stability of rigid components and the flexibility of the flexible film substrate, resolving the contradiction between reliability and adaptability.
2Adaptability or versatility
If the semiconductor chip is made thinner to improve flexibility, then the bendability is improved, but the manufacturing precision and structural strength are deteriorated
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness of the flexible film and semiconductor chip within specific ranges. By carefully controlling these dimensional parameters, the package achieves sufficient flexibility for curved displays while maintaining adequate structural strength and manufacturing feasibility.
3Strength
If a flexible cover layer is added to improve adhesion and flexibility, then the bonding strength is improved, but the device complexity is increased
Solution Approach 1:
The flexible cover layer is implemented as a thin film structure that provides adhesion and flexibility without adding significant complexity. The thin film nature allows it to conform to the underlying structures while maintaining simplicity in the overall package design.
Solution Approach 2:
The cover layer uses composite materials that combine adhesive properties with flexibility, achieving both bonding strength and adaptability in a single integrated layer rather than requiring multiple separate components, thus limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes the radius of curvature of the semiconductor chip, reduces the risk of damage, and simplifies the manufacturing process while maintaining high adhesion and flexibility, ensuring effective operation on various display panels.
Implementation Method 1
an underfill material formed between the semiconductor chip and the curved flexible film, and a flexible cover layer attached to the top surface of the semiconductor chip
Data Source
AI summary
A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.