Flexible Semiconductor Package Roll-to-Roll Microcrack Prevention

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional roll-to-roll continuous processes for panel level semiconductor packaging result in microcracks in the molding layer, leading to chemical leakage and delamination, which degrade product reliability.

Innovation Solution

A flexible semiconductor package is manufactured using a roll-to-roll process with a molding layer composed of pre-preg, where the resin content is 60% or more, and a curing degree of 50% to 80%, along with a structure including a first insulating layer, a second insulating layer, and a wiring protection layer, to prevent cracks and ensure adhesion during the packaging process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a roll-to-roll continuous process is applied to conventional panel level packaging, then manufacturing efficiency and cost reduction are improved, but microcracks are generated in the molding layer causing chemical leakage and delamination

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidproduct reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes the material parameters of the molding layer by using a flexible resin-based molding layer instead of a conventional rigid EMC molding layer. This parameter change in material flexibility allows the molding layer to withstand the deformation and stress of the roll-to-roll continuous process without generating microcracks, thereby maintaining product reliability while achieving manufacturing efficiency improvements

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite material structure where a flexible resin-based molding layer is combined with a substrate and semiconductor chip. This composite structure provides both the flexibility needed for roll-to-roll processing and the structural integrity required to prevent microcrack formation, resolving the contradiction between manufacturing efficiency and product reliability

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If a roll-to-roll continuous process is applied to conventional panel level packaging, then manufacturing cost reduction is improved, but microcracks cause chemical leakage and delamination

Engineering Contradiction:

Improvemanufacturing costVSAvoidchemical leakage

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent changes the chemical composition and physical properties of the molding layer by using a flexible resin-based material with appropriate glass fiber content. This parameter change ensures the molding layer remains crack-free during roll-to-roll processing, preventing chemical leakage while maintaining cost-effectiveness

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent converts the potential harm of using a flexible material (which might be perceived as weaker) into a benefit by demonstrating that the flexibility actually prevents microcrack formation during the roll-to-roll process. The flexible resin-based molding layer accommodates process-induced stresses without cracking, thereby preventing chemical leakage and turning a perceived weakness into a strength

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If a roll-to-roll continuous process is applied to conventional panel level packaging, then manufacturing cost reduction is improved, but delamination occurs

Engineering Contradiction:

Improvemanufacturing costVSAvoidadhesion stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameters by using a flexible resin-based molding layer with optimized composition and structure. This parameter change enhances the adhesion stability of the molding layer, preventing delamination during the roll-to-roll continuous process while maintaining manufacturing cost advantages

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a flexible resin-based molding layer that acts as a flexible shell encompassing the semiconductor chip and substrate. This flexible film structure maintains stable adhesion throughout the roll-to-roll process by accommodating deformation without delamination, thereby enabling cost-effective manufacturing with maintained structural stability

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the application of a roll-to-roll process to panel level packaging without microcracks, enhancing product reliability by improving adhesion and reducing manufacturing costs.

Implementation Method 1

a flexible resin-based molding layer 140, hereinafter referred to as a molding layer, which is continuously thermally cured to have a curing degree of 50% to 80%

Methodology Applied

Scientific EffectThermal curing: Heat Treatment

Data Source

PatentUS11139220B2Flexible semiconductor package formed by roll-to-roll process

Publication Date: 2021.10.05 HAESUNG CO LTD

AI summary

A flexible semiconductor package includes a semiconductor chip accommodated in a cavity formed in a substrate, a molding layer covering an entire upper surface of the substrate and the cavity, and a wiring portion including an insulating layer and a redistribution member provided under lower surfaces of the substrate and the semiconductor chip, wherein the molding layer includes a pre-preg in which a resin is impregnated with a glass fabric, and the molding layer and the insulating layer are attached to the semiconductor chip accommodated in the cavity by a roll-to-roll continuous process.