Flexible Semiconductor Package Segmentation for Bending Protection

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Solution Overview

Problem

Conventional semiconductor device packages with inflexible package bodies limit the overall flexibility of the package and are prone to damage from excessive bending, which can also lead to issues like delamination due to coefficient of thermal expansion mismatches and damage during molding or encapsulation operations.

Innovation Solution

Incorporating flexible members on a flexible substrate within the package body, which separates into distinct parts, allowing for increased flexibility and protection against bending, and using removable flexible materials for conductive contacts to facilitate testing and reduce manufacturing defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an inflexible package body is used to encapsulate the semiconductor device, then the package body provides structural protection and support, but the overall flexibility of the semiconductor device package is limited and overbending can damage the FPCB

Engineering Contradiction:

Improvestructural protectionVSAvoidflexibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The package body is divided into multiple segments separated by flexible members, allowing each segment to move independently while maintaining overall structural integrity. This segmentation enables the package to flex without damaging the FPCB while still providing protective encapsulation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Flexible members are introduced within the package body structure to create flexible sections that can bend and deform without damaging internal components. These flexible members allow the package body to adapt to bending stresses while maintaining protection for the FPCB and electronic components.

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of manufacture

If an inflexible package body is used, then manufacturing and assembly are simplified, but delamination can occur due to coefficient of thermal expansion mismatches and damage can occur during molding or encapsulation operations

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidresistance to delamination and damage

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The package body incorporates materials with different flexibility parameters and thermal expansion coefficients in different sections. The flexible members have higher elasticity and different thermal properties compared to the rigid package body, allowing the structure to accommodate thermal expansion mismatches and reduce delamination risks during manufacturing and operation.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If flexible members are incorporated into the package body, then the flexibility and resistance to bending damage are improved, but the device complexity increases

Engineering Contradiction:

ImproveflexibilityVSAvoidpackage structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Flexible members are nested within the package body structure, with each flexible member positioned in specific locations to provide targeted flexibility where needed. This nested arrangement allows the complex flexible structure to be integrated within the existing package body framework, minimizing additional complexity while maximizing flexibility benefits.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS10083911B2Semiconductor device package and method of manufacturing the same

Publication Date: 2018.09.25 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.