Flexible Semiconductor Package Process with Conductive Vias
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Solution Overview
Problem
Conventional stacked semiconductor device packages require predetermined semiconductor device configurations, limiting selectivity and flexibility in device collocation during the manufacturing process.
Innovation Solution
A package process involving a carrier with a circuit mother board, where first semiconductor devices with conductive vias are bonded to the board, and a protection layer is formed to expose the vias, allowing for optional and selective bonding of second semiconductor devices, enabling flexible device collocation and increased selectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor devices are stacked together first to form a stacked structure, then the package density is improved and the dimension of the package structure is decreased, but the kind or circuit layout of the semiconductor devices needs to be predetermined at the start of the package process, and thus the selectivity or the collocation of semiconductor device is restricted
Solution Approach 1:
The patent segments the package manufacturing process into two independent stages: first, forming a stacked structure of semiconductor devices with conductive vias; second, selectively bonding additional semiconductor devices to the stacked structure. This segmentation allows the first stage to optimize for compactness while the second stage provides flexibility in device selection and collocation, resolving the contradiction between reduced package dimension and increased device selectivity.
Solution Approach 2:
The patent applies preliminary action by pre-forming the stacked structure of semiconductor devices with exposed conductive vias before the final device selection and bonding stage. This preliminary stacked structure serves as a flexible substrate that can accommodate different combinations of semiconductor devices, enabling both compact packaging and high adaptability in device collocation.
2Reliability
If the stacked structure of semiconductor devices is bonded to a circuit board through the TSVs, then the electrical connection is established, but the kind or circuit layout of the semiconductor devices needs to be predetermined at the start of the package process
Solution Approach 1:
The patent introduces dynamics by making the circuit layout and device collocation adaptable rather than fixed. The stacked structure with exposed conductive vias serves as a dynamic platform that can be configured with different semiconductor devices based on practical requirements, allowing the circuit layout to be optimized for each specific application while maintaining reliable electrical connections through the conductive vias.
Data Source
AI summary
A package process includes following steps. A circuit mother board comprising a plurality of circuit boards is disposed on a carrier. Semiconductor devices are provided, wherein each of the semiconductor devices has a top surface and a bottom surface opposite thereto. Each of the semiconductor devices has conductive vias each having a first end surface and a second end surface exposed by the bottom surface of the semiconductor device. The semiconductor devices are connected to the corresponding circuit boards through their conductive vias with their bottom surface facing the circuit mother board. An insulating paste is formed between each of the semiconductor devices and its corresponding circuit board. A protection layer is formed on the circuit mother board to cover the semiconductor devices. Then, the protection layer and the semiconductor devices are thinned to expose the first end surface of each of the conductive vias.