Flexible Semiconductor on Polymer Substrate via Phase Change Transfer
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Solution Overview
Problem
Existing semiconductor device fabrication techniques struggle to produce ultra-thin, flexible circuits that can maintain integrity and functionality when bent to tight radii, as they lack suitable substrates that provide both mechanical support and flexibility, limiting the complexity and density of integrated circuits.
Innovation Solution
The process involves coating VLSI circuits with a polymer, thinning them on a carrier wafer, and converting the polymer into a solid substrate, allowing for the integration of single crystalline semiconductor materials into a flexible polymer substrate, which can be used as a mechanical support for further processing and assembly, enabling the production of ultra-thin, flexible semiconductor devices with tighter bending radii and reduced parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional semiconductor fabrication techniques are used, then device functionality is maintained, but flexibility and ultra-thin profile are not achieved
Solution Approach 1:
The patent applies this principle by transferring the semiconductor device from a rigid silicon substrate to a flexible polymer substrate through a multi-step process involving bonding layer formation, mechanical breaking of the silicon substrate, and release of the device onto the polymer carrier. This enables the device to achieve ultra-thin profile and flexibility while maintaining functionality.
Solution Approach 2:
The patent extracts the semiconductor device from its traditional rigid silicon substrate by selectively breaking the silicon wafer and releasing the device onto a flexible polymer substrate. This extraction removes the rigid support structure while preserving the device's electrical functionality and enabling flexibility.
2Length of moving object
If device thickness is reduced to achieve flexibility, then flexibility is improved, but mechanical support and structural integrity deteriorate
Solution Approach 1:
The patent creates an ultra-thin device structure by transferring the semiconductor device to a flexible polymer substrate, achieving thickness reductions to less than 10 micrometers. The flexible polymer provides the necessary mechanical support for such thin structures while enabling bendability to tight radii.
Solution Approach 2:
The patent employs composite material structures combining the semiconductor device layer with a flexible polymer substrate and bonding layers. This composite structure provides both the mechanical support needed for structural integrity and the flexibility required for ultra-thin profiling and bending to tight radii.
3Ease of operation
If polymer coating is applied to enable flexibility, then flexibility is achieved, but processing complexity increases
Solution Approach 1:
The patent uses a bonding layer as an intermediary between the semiconductor device and the flexible polymer substrate. This bonding layer facilitates the transfer process and enables the device to be released onto the polymer carrier, achieving flexibility while managing processing complexity through a systematic multi-step approach.
4Productivity
If ultra-thin devices are fabricated for high density packaging, then packaging density is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: forming the bonding layer on the silicon substrate, mechanically breaking the silicon wafer into individual device regions, and releasing each device onto the flexible polymer substrate. This segmentation enables ultra-thin device fabrication and high-density packaging while managing manufacturing complexity through systematic process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in highly flexible semiconductor devices with improved durability and reduced parasitic capacitance, enabling the production of complex, stacked three-dimensional structures and enhanced performance in microelectronic systems.
Implementation Method 1
converting the polymer into a solid substrate
Data Source
AI summary
Semiconductor On Polymer (SOP) is a flexible ultra-thin substrate that can be used as the starting material for CMOS, MEMS or Complex Interconnects such as an interposer. The described process results in a flexible SOP device with open bond pads. After deposition of a liquid polymer onto a semiconductor substrate, the polymer is converted to a solid, creating a new substrate that is temporarily bonded to a carrier wafer. The semiconductor layer is then etched to be ultra-thin and highly uniform, specifically, a single crystalline silicon layer. Following fabrication of devices and interconnects on the polymer substrate, the ultra thin wafer is released from the carrier wafer in substrate form to be used whole or tiled for subsequent assembly. Among other advantages, the flexible format of the SOP substrate enables low resistance 3-D interconnects, and provides for a significant increase in performance due to a reduction in parasitic capacitance.