Flexible Semiconductor Package with Removable Rigid Carrier

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Solution Overview

Problem

Wearable electronic devices require flexible semiconductor packages that can adapt to body contours, but these packages are prone to deformation during assembly and transportation, leading to defects and reduced yield.

Innovation Solution

A semiconductor device carrier unit is created by combining a flexible semiconductor device package with a rigid substrate attached using adhesive, which is later released after assembly to prevent deformation, comprising a flexible substrate, semiconductor chips, conductive elements, encapsulant, and external terminals, with the rigid substrate temporarily protecting the package during transport and assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flexible semiconductor packages are used to adapt to body contours, then adaptability is improved, but the packages are prone to deformation during assembly and transportation

Engineering Contradiction:

Improveadaptability to body contoursVSAvoiddeformation during assembly and transportation

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A rigid support substrate is attached to the flexible semiconductor package before assembly and transportation. This preliminary action provides mechanical support and prevents deformation during handling, while the flexible package remains adaptable to body contours during actual use when the support substrate is removed

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The rigid support substrate acts as an intermediary that temporarily protects the flexible semiconductor package during manufacturing and transportation. The adhesive serves as a mediator to attach and later release the support substrate without damaging the flexible package

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If flexible semiconductor packages are used for wearable devices, then ease of operation is improved, but manufacturing precision deteriorates due to permanent deformation

Engineering Contradiction:

Improveflexibility for wearable applicationsVSAvoidpermanent deformation during assembly

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The rigid support substrate is attached in advance to maintain the flexible package's shape and prevent permanent deformation during assembly operations. This ensures manufacturing precision is maintained while preserving the package's flexibility for wearable applications

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The mechanical properties of the package system are changed by adding the rigid support substrate during manufacturing, making it rigid for precision assembly, and then restoring flexibility by removing the substrate after assembly is complete

Inventive Principle:

Principle #35Parameter changes

3Reliability

If rigid support substrate is attached to flexible semiconductor package, then reliability is improved by preventing deformation, but device complexity increases

Engineering Contradiction:

Improveprevention of deformation during transportVSAvoidcombination of rigid substrate and flexible package

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The rigid support substrate is extracted as a separate, removable component rather than being integrated permanently into the flexible package. This allows the complexity to be temporary and removable, providing reliability during transport while maintaining simplicity for the final wearable device

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution minimizes damage to the flexible semiconductor device package during assembly and transportation, improving the yield and reliability of wearable electronic devices by preventing excessive bending and deformation.

Implementation Method 1

adhesive disposed on the flexible semiconductor device package, and a rigid substrate disposed on the adhesive and adhered to the flexible semiconductor device package by the adhesive

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10453671B2Combined structure of flexible semiconductor device package and method of transporting the flexible semiconductor device

Publication Date: 2019.10.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A carrier or manufacturing unit includes a combination of a flexible semiconductor device package, adhesive disposed on the flexible semiconductor device package and a rigid substrate disposed on the adhesive. The flexible semiconductor device package may be protected during transport and/or assembly by the rigid substrate. In a method of manufacturing an electronic product such as wearable technology that requires a flexible semiconductor device package, the unit can be transported to a work station and physically and/or electrically connected to another/other component(s) of the technology. Then the rigid substrate is removed.