Flexible Sensor Module Layout for Precise Element Positioning

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Solution Overview

Problem

Existing technologies face challenges in easily configuring a sensor module using a flexible circuit board due to difficulties in positioning the sensor element, which affects the performance of the sensor device.

Innovation Solution

A sensor module design that includes a flexible circuit board wound around an intermediate member, with a sensor element lead portion penetrating and being inserted into the intermediate member, allowing for precise positioning through overlapping portions of the circuit board and insertion into the intermediate member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible circuit board is used to create a sensor module, then the device can be made more adaptable and easier to install in various configurations, but it becomes difficult to position and secure the sensor element, affecting performance

Engineering Contradiction:
Improveconfigurability of sensor moduleVSAvoidpositioning accuracy of sensor element
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces an intermediate member as a mediator between the flexible circuit board and the sensor element. This intermediate member provides a stable mounting surface and positioning structure, enabling precise sensor element placement while maintaining the flexibility and adaptability of the flexible circuit board. The intermediate member acts as a bridge that resolves the conflict between flexibility and positioning precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If a flexible circuit board is used without additional fixing components, then the device complexity is reduced, but the sensor element cannot be securely positioned

Engineering Contradiction:
Improvenumber of fixing componentsVSAvoidsecuring of sensor element
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent merges the functions of multiple components into the intermediate member. This intermediate member integrates the positioning, mounting, and securing functions that would otherwise require separate fixing components. By combining these functions into a single integrated structure, the patent reduces device complexity while maintaining reliable sensor element positioning.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If the flexible circuit board is wound around an intermediate member with overlapping portions, then the lead portion can be securely inserted and positioned, but the structure becomes more complex

Engineering Contradiction:
Improvepositioning of lead portionVSAvoidwinding structure of circuit board
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a curved or wound configuration of the flexible circuit board around the intermediate member. This curved structure allows the circuit board to wrap around the intermediate member with overlapping portions, creating natural positioning features for the lead portion. The curvature enables secure insertion and positioning of the lead portion while utilizing the flexibility of the circuit board, transforming a potential complexity into a functional advantage.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentEP4651639A1Sensor module and sensor device
Publication Date: 2025.11.19 SMC CORP
  • EP4651639A1 patent drawingFigure 1
  • EP4651639A1 patent drawingFigure 2
  • EP4651639A1 patent drawingFigure 3

AI summary

This sensor module (12) comprises an intermediate member (18), a flexible substrate (16) that is wound around the intermediate member, and a sensor element (20) that comprises a lead part (34) that passes through the flexible substrate and is inserted into the intermediate member, wherein: the flexible substrate is wound around the intermediate member so that a first portion (24) of the flexible substrate is superimposed on and in contact with a second portion (26) that differs from the first portion of the flexible substrate; and the lead part passes through the first portion and the second portion and is inserted into the intermediate member.