Flexible Multilayer Sensor for Multi-Dimensional Joint Deformation

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Solution Overview

Problem

Existing sensors struggle to accurately detect bending movements with multiple degrees of freedom, particularly in joints like the shoulder, hip, and wrist, which require more stringent requirements for precise motion capture in augmented reality and virtual reality applications.

Innovation Solution

A flexible sensor with multilayer structures and sensing structures on both sides of a substrate, capable of converting deformations into electrical signals, uses a processing circuit to determine deformations in multiple dimensions by analyzing resistance and capacitance changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a single-axis bending sensor is used, then the sensor structure is simple, but it cannot accurately detect multi-degree-of-freedom joint movements

Engineering Contradiction:
Improvedetection accuracy of multi-degree-of-freedom movementsVSAvoidsensor structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor is divided into multiple independent sensing units (first sensing unit, second sensing unit, third sensing unit, fourth sensing unit) arranged in different orientations. Each sensing unit detects deformation in a specific direction, and the combination of these segmented measurements enables comprehensive detection of multi-degree-of-freedom movements while keeping each individual unit simple in structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from single-axis detection to multi-dimensional detection by arranging sensing units in different spatial orientations (first direction, second direction, third direction, fourth direction). This dimensional expansion allows the sensor to capture complex joint movements that require detection in multiple directions simultaneously, resolving the contradiction between detection accuracy and structural simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If sensing structures are added to detect deformation in multiple dimensions, then the measurement precision improves, but the device complexity increases

Engineering Contradiction:
Improvedeformation detection accuracy in multiple dimensionsVSAvoidnumber of sensing structures
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Each sensing unit is designed with multi-functionality, capable of detecting deformations in different directions while maintaining a unified structure. The sensing units can detect deformations along the first direction, second direction, third direction, and fourth direction, making them universal detection elements that reduce the need for separate specialized sensors for each dimension.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple sensing units are merged into a single integrated sensor device with a unified flexible substrate and common electrode structure. This merging approach allows the sensor to achieve multi-dimensional detection capability while maintaining a compact form factor and reducing overall device complexity compared to using separate sensors for each detection dimension.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If the sensor detects deformations in at least two dimensions, then the accuracy of motion capture improves, but the manufacturing complexity increases

Engineering Contradiction:
Improvemotion capture accuracyVSAvoidsensor manufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The sensor employs local quality differentiation by creating distinct sensing regions with specific orientation characteristics. Each sensing unit is positioned and oriented to detect deformations in particular directions, allowing the manufacturing process to focus on creating localized functional zones with specific properties rather than requiring complex global structural variations throughout the entire sensor.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes in the flexible substrate (such as changes in resistance, capacitance, or other electrical properties) to detect deformations. By monitoring changes in these parameters across different sensing units, the sensor achieves accurate multi-dimensional motion capture while maintaining relatively simple manufacturing processes, as the detection capability arises from parameter variations rather than complex structural modifications.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise recognition and reconstruction of human movements by accurately detecting bending, stretching, and compressive deformations in complex joint movements, enhancing the accuracy of motion capture in smart wearable devices.

Implementation Method 1

The processing circuit reads first parameters, each of which is related to a resistance or a capacitance of the first sensing structure and the second sensing structure

Methodology Applied
Scientific EffectPiezoresistive effect: Piezoresistive Effect

Implementation Method 2

The processing circuit reads first parameters, each of which is related to a resistance or a capacitance of the first sensing structure and the second sensing structure

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20250369743A1sensors
Publication Date: 2025.12.04 SHENZHEN SHOKZ CO LTD
  • US20250369743A1 patent drawing
  • US20250369743A1 patent drawing
  • US20250369743A1 patent drawing

AI summary

Disclosed herein is a sensor, including: a flexible substrate; a first sensing structure, a second sensing structure, and a processing circuit. The first sensing structure and the second sensing structure each include a multilayer structure arranged on a same side surface of the flexible substrate in a thickness direction. Each layer of the multilayer structure is stacked in the thickness direction. The processing circuit reads first parameters, each of which related to a resistance or a capacitance of the first sensing structure and the second sensing structure, respectively. The processing circuit determines a deformation in at least two dimensions of the flexible substrate based on the first parameters.