Flexible Force Sensor Patch Assembly for Compact Earphones
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Solution Overview
Problem
Conventional methods for assembling sensor circuits in electronic devices, such as earphones, require additional retention components that occupy significant internal space and complicate the assembly process.
Innovation Solution
A force sensor patch is integrated into the earphone device by being pasted onto specific electrodes of a printed circuit board, allowing it to detect user pressure and be used as a G-sensor, without occupying excessive space and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional larger sensor circuit is used, then the sensor can detect user pressure, but additional retention assembly components are needed that occupy considerable internal circuit space
Solution Approach 1:
The patent applies this principle by using a flexible force sensor patch instead of a conventional rigid sensor circuit. The flexible nature of the patch allows it to conform to the circuit board surface and be secured through adhesive bonding rather than requiring separate retention assembly components, thereby reducing the occupied internal circuit space while maintaining sensor detection functionality.
Solution Approach 2:
The patent merges the sensor circuit functionality directly into a flexible patch that can be adhered to the circuit board. This integration eliminates the need for separate retention assembly components, as the patch itself becomes the mounted sensor element, combining the sensing function with the mounting structure.
2Stability of the object's composition
If additional retention assembly components are installed, then the sensor circuit is secured, but the assembly procedure becomes complicated
Solution Approach 1:
The flexible force sensor patch is designed to be easily adhered to the circuit board using adhesive bonding. This eliminates the need for complex retention assembly components and simplifies the assembly procedure while ensuring the sensor circuit remains securely located through the adhesive bond between the flexible patch and the circuit board.
3Volume of stationary object
If a thin flexible force sensor patch is used, then internal space is saved and assembly is simplified, but the sensor must be reliably coupled to the circuit board
Solution Approach 1:
The patent extracts the essential electrical connection function by directly adhering the force sensor patch to the specific electrode on the circuit board. This direct adhesive bonding approach establishes reliable electrical coupling between the sensor patch and the circuit board without requiring additional connection components, thereby maintaining reliability while saving internal space.
Data Source
AI summary
An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.