Flexible Piezoresistive Sensor Assembly for Reliable PCB Connection
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Solution Overview
Problem
Conventional sensor technologies are not well-suited for bridging the gap between computing devices and the physical world, particularly in applications envisioned by the 'Internet of Things', where flexible and adaptable sensing solutions are required to translate physical information into digital formats effectively.
Innovation Solution
The development of piezoresistive sensors integrated with flexible substrates, where conductive traces are formed directly on the substrates, allowing resistance to change with mechanical deformation, enabling the detection of force, pressure, and distortion, and utilizing conductive adhesives and mechanical members for secure connections to printed circuit board assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional sensor technology is used, then manufacturing and integration are straightforward, but the sensors are not adaptable to flexible substrates and cannot effectively bridge the gap between computing devices and the physical world
Solution Approach 1:
The patent employs flexible substrates as the base for sensor integration, allowing the sensor system to conform to non-planar surfaces and dynamic environments. This enables the sensor to adapt to various physical forms while maintaining functional integrity through careful design of the flexible platform.
Solution Approach 2:
The patent utilizes composite material structures combining rigid sensor elements with flexible substrate materials. This composite approach allows the sensor to maintain structural integrity and sensing accuracy while adapting to flexible configurations, resolving the contradiction between adaptability and reliability.
2Adaptability or versatility
If sensors are integrated directly on flexible substrates with conductive traces, then flexibility and adaptability are improved, but connection reliability to rigid PCBAs becomes challenging
Solution Approach 1:
The patent introduces intermediate connection structures including flexible circuit board assemblies and adaptive connectors that serve as mediators between the flexible substrate and rigid PCBA. These intermediates accommodate the mechanical mismatch while ensuring reliable electrical connections, allowing the flexible sensor to interface with rigid processing systems.
Solution Approach 2:
The patent employs dynamic connection mechanisms that can accommodate movement and deformation between the flexible substrate and rigid PCBA. This includes flexible traces designed to withstand repeated bending and connection structures that maintain electrical continuity under mechanical stress, ensuring reliable connections despite flexibility requirements.
3Strength
If mechanical members are used to secure PCBA to flexible substrate, then mechanical strength is improved, but the complexity of assembly increases
Solution Approach 1:
The patent combines multiple functions into integrated connection structures that simultaneously provide mechanical attachment, electrical connection, and alignment features. By merging these functions into unified components, the assembly process is simplified while maintaining strong mechanical bonds between the flexible substrate and PCBA.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of flexible, adaptable sensors that can detect various physical inputs, including force, pressure, and distortion, facilitating a wide range of applications by converting mechanical changes into digital signals for processing and control functions.
Implementation Method 1
a flexible piezoresistive substrate and a sensor trace pattern including two or more conductive traces formed directly on the piezoresistive substrate. Resistance between the conductive traces varies with distortion or deformation of the piezoresistive substrate.
Implementation Method 2
Conductive adhesive provides electrical connections between the pads of the PCBA and the conductors of the substrate.
Data Source
AI summary
Sensors incorporating piezoresistive materials are described. One class of includes conductive traces formed directly on or otherwise integrated with the piezoresistive material.