Thin Flexible Sensor With Segmented Arrays On Polyimide
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Solution Overview
Problem
Existing semiconductor-based sensors for measuring acceleration, force, or pressure on flexible substrates face challenges such as thermal budget restrictions, mechanical integrity, surface roughness, signal routing, adhesion issues, high cost, and lack of real-time feedback for adjusting to stimuli like touch, force, acceleration, and flow.
Innovation Solution
A compact, thin, and flexible sensor design featuring a substrate with sensor arrays, a power source, processor, and output interface, which is self-contained, wireless, and self-powered, providing real-time feedback, and includes a method for manufacturing using a MEMS process and polyimide layers to overcome previous design issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor-based sensors are implemented on flexible substrates, then flexibility is improved, but mechanical integrity and adhesion deteriorate
Solution Approach 1:
The sensor is divided into discrete sensor arrays that can be independently mounted on the flexible substrate. This segmentation allows each sensor element to maintain its structural integrity while the overall assembly achieves flexibility through the modular configuration and flexible interconnections.
Solution Approach 2:
The patent employs thin film structures and flexible substrate materials to achieve the desired flexibility. The sensor elements are fabricated as thin films that can conform to flexible substrates, eliminating the need for rigid semiconductor packages while maintaining sensing functionality.
2Extent of automation
If sensor arrays are integrated on flexible substrate, then real-time feedback capability is improved, but manufacturing complexity increases
Solution Approach 1:
The flexible substrate serves multiple functions simultaneously: it acts as the mechanical support structure, the electrical interconnection medium, and the mounting platform for sensor arrays. This multi-functionality reduces the number of separate manufacturing steps and components needed, thereby simplifying the overall manufacturing process while enabling real-time feedback through integrated sensor arrays.
3Weight of moving object
If thin flexible substrate is used, then portability is improved, but adhesion of metals to substrate deteriorates
Solution Approach 1:
The patent utilizes composite material structures where metal interconnection layers are combined with flexible substrate materials. This composite approach enables the metal layers to adhere properly to the thin flexible substrate through appropriate material selection and interface engineering, maintaining both the portability benefits of thin substrates and the reliable electrical connections required for sensor operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-cost, portable, and easily usable sensor that offers real-time feedback, overcoming previous design challenges by being compact, flexible, and capable of measuring acceleration, force, or pressure without degrading under stretching or flexing, and can be integrated into various devices or clothing.
Implementation Method 1
The one or more sensor arrays measure acceleration, force or pressure
Data Source
AI summary
The present invention provides a sensor (100, 300, 400) that includes a thin and substantially flat flexible substrate (102, 406) having one or more sensor arrays (104, 302), a power source (106, 416), an output interface (108, 418) and a processor or analog circuit (304), all of which are disposed on the substantially flat flexible substrate (102, 406). The substrate (102, 406) can be any shape (e.g., rectangular, circular, a polygon, an irregular shape that is decorative) and made from a polymer, metal film or other suitable material. Note that the substrate can be rigid or semi-flexible instead of flexible. A protective layer may cover the sensor array (104, 302), the power source (106, 416), and the processor or analog circuit (304). Alternatively, a protective covering can be used to encapsulate the device. The one or more sensor arrays (104, 302) measure acceleration, force or pressure.