Flexible Radiographic Sensor Substrate With Removable Peripheral Support
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Solution Overview
Problem
Existing digital radiographic detector technologies face challenges in achieving flexible and durable configurations due to the use of glass substrates, which limit portability and durability, and require complex integration processes that can degrade imaging performance.
Innovation Solution
A digital radiographic image sensor panel with a flexible substrate and a secondary substrate that allows for removal of peripheral regions, using different adhesives to secure the image sensor array and scintillator, enabling the creation of a flexible and durable detector module with improved handling characteristics and imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If glass substrates are used for image sensor arrays, then manufacturing precision and stability are improved, but weight, flexibility, and portability deteriorate
Solution Approach 1:
The patent changes the substrate material parameter from glass to flexible materials such as polyimide or polyester. This material substitution maintains sufficient manufacturing precision for the image sensor array while dramatically reducing weight and enabling flexible configurations, directly resolving the contradiction between manufacturing precision and weight/portability
Solution Approach 2:
The patent employs composite material structures where flexible substrate materials are combined with functional layers (image sensor array, scintillator, adhesive layers). This composite approach allows the system to achieve both flexibility and the required manufacturing precision through careful material selection and layer integration
2Weight of moving object
If flexible substrates are used for image sensor arrays, then weight and flexibility are improved, but manufacturing precision and stability deteriorate
Solution Approach 1:
The patent selects specific flexible substrate materials (polyimide, polyester) with controlled physical parameters such as thickness, thermal expansion coefficient, and mechanical strength. These parameter optimizations ensure that manufacturing precision is maintained despite using flexible materials, resolving the contradiction between weight reduction and manufacturing precision
Solution Approach 2:
The patent applies different adhesive materials with varying tack levels to different regions of the flexible substrate. High-tack adhesive is used in the peripheral region for secure bonding, while lower-tack adhesive is used in the active imaging region to prevent damage to the image sensor array. This local differentiation maintains manufacturing precision while using flexible substrates
3Strength
If uniform high-tack adhesive is used across the entire substrate, then bonding strength is improved, but damage to the image sensor array increases
Solution Approach 1:
The patent divides the adhesive application into two distinct zones: a peripheral region with high-tack adhesive for strong bonding, and an active imaging region with lower-tack adhesive that bonds sufficiently without exerting excessive stress on the image sensor array. This local differentiation resolves the contradiction between bonding strength and prevention of array damage
Solution Approach 2:
The adhesive layer is segmented into functionally distinct regions based on their bonding requirements. The peripheral adhesive provides structural support and secure attachment, while the central adhesive provides gentle bonding that preserves the integrity of the sensitive image sensor array, resolving the contradiction between overall bonding strength and localized protection
4Reliability
If ESD protection circuitry is retained in the manufacturing process, then manufacturing reliability is improved, but imaging performance deteriorates due to high leakage current
Solution Approach 1:
The patent removes ESD protection circuitry during the manufacturing process before final assembly and testing. This preliminary removal action eliminates the source of high leakage current that would degrade imaging performance, while the manufacturing reliability is maintained through controlled removal processes and quality assurance steps
Solution Approach 2:
The patent extracts and removes the ESD protection circuitry from the flexible substrate during manufacturing. This extraction eliminates the harmful leakage current effect on imaging performance while the manufacturing process remains reliable through structured removal procedures and verification steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a flexible and durable digital radiographic detector that can be used in non-planar configurations, improving portability and durability while maintaining high imaging quality by simplifying integration processes and reducing the impact of electrostatic discharge protection circuitry on imaging performance.
Implementation Method 1
A first adhesive with a higher tack is placed on the second substrate in a peripheral region outside the array
Implementation Method 2
A second adhesive with a lower tack is placed on the second substrate in the active imaging region
Implementation Method 3
lamination or direct deposition of a scintillator (typically gadolinium oxysulfide or cesium iodide)
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A digital radiographic image sensor includes a flexible first substrate with an image sensor array. A scintillator is formed over the array, and bonding pads in a peripheral region outside the array are connected to the array. A second substrate is attached to a bottom of the first substrate and includes a scribed or perforated break line to enable removal of a peripheral region of the second substrate.