Flexible Sensor Substrate Stripping Mechanism
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Solution Overview
Problem
Radiation image capturing apparatuses face challenges with mechanical stripping of flexible sensor substrates from rigid supports, which can cause damage to circuit substrates due to bending, leading to electrical interference and increased resistance values.
Innovation Solution
The apparatus employs flexible and non-flexible cable connections between the sensor substrate and circuit substrates, with the flexible driving unit mounted in flexible cables and signal processing units in non-flexible substrates, reducing electrical interference and allowing easier bending and stripping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical stripping is performed on a flexible sensor substrate connected to a rigid circuit substrate, then the sensor substrate can be separated from the support, but the rigid circuit substrate may be damaged due to bending
Solution Approach 1:
The patent applies this principle by making the circuit substrate flexible rather than rigid. The flexible circuit substrate can bend during the mechanical stripping process without breaking, allowing the sensor substrate to be separated from the support while maintaining circuit substrate integrity. This resolves the contradiction by enabling the stripping process without damaging the circuit substrate.
Solution Approach 2:
The patent applies this principle by transitioning from a static rigid circuit substrate to a dynamic flexible circuit substrate that can adapt its shape during the stripping process. The flexible substrate can temporarily bend to accommodate the mechanical stripping action, then return to its original shape, thereby preventing damage while enabling the separation process.
2Reliability
If a rigid circuit substrate is used, then electrical connection is stable, but electrical interference increases and resistance values increase during bending
Solution Approach 1:
The patent applies this principle by using a flexible circuit substrate that maintains stable electrical connections while reducing electrical interference. The flexibility allows the substrate to bend without creating the high resistance and interference problems associated with rigid substrates during the stripping process, thereby resolving both the stability and interference issues.
Solution Approach 2:
The patent applies this principle by changing the physical parameter of the circuit substrate from rigid to flexible. This parameter change fundamentally alters how the substrate behaves during bending, maintaining electrical connection stability while significantly reducing electrical interference and resistance increases that would occur with a rigid substrate.
Data Source
AI summary
A radiation image capturing apparatus including a sensor substrate including a flexible base material and a plurality of pixels accumulating electric charges generated in accordance with radiation, a flexible first cable of which one end is electrically connected to the sensor substrate, and a flexible first circuit substrate that is electrically connected to the other end of the first cable and in which a first circuit unit driven in a case of reading out the electric charges accumulated in the plurality of pixels is mounted is provided.