Flexible Shield Structure for EMI Reduction in Compact Electronics
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Solution Overview
Problem
Existing electronic devices face challenges in effectively managing Electro-Magnetic Interference (EMI) due to the high cost and complexity of shield structures, which often require cumbersome welding processes and limit component mounting space, leading to increased manufacturing costs and reduced productivity.
Innovation Solution
A shield structure that surrounds the side surfaces of a printed circuit board and frame structures, eliminating the need for a separate finger part welded on the shield can, thereby reducing manufacturing costs and minimizing mounting space, using a flexible sheet with bending portions to enhance shielding efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield can with welded finger part is used to shield EMI, then the shielding effectiveness is improved, but the manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent integrates the shield can and finger part into a single integrated shield structure, eliminating the need for separate welding operations. The integrated design combines the shielding function and component mounting function into one piece, thereby improving productivity by removing cumbersome welding steps while maintaining EMI shielding effectiveness.
Solution Approach 2:
The integrated shield structure serves multiple functions simultaneously: it provides EMI shielding, acts as a mounting structure for electronic components, and eliminates the need for separate finger parts. This multi-functionality reduces the number of parts and assembly steps, thereby improving manufacturing productivity without compromising shielding performance.
2Object-affected harmful factors
If a shield can with side wall is used to shield EMI, then the shielding effectiveness is improved, but the mounting space increases and the device becomes larger
Solution Approach 1:
The patent utilizes the vertical dimension by having the integrated shield structure extend upward from the printed circuit board to provide shielding. This allows the shield to be effective without requiring additional horizontal space, thereby maintaining compact device volume while achieving proper EMI shielding coverage.
Solution Approach 2:
The integrated shield structure is designed to nest around the electronic components mounted on the printed circuit board, with the shield can positioned vertically above the board. This nesting arrangement provides effective shielding coverage without increasing the overall device footprint, maintaining compact dimensions while achieving shielding effectiveness.
3Object-affected harmful factors
If a shield can with welded finger part is used to shield EMI, then the shielding effectiveness is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent combines the shield can and finger part into a single integrated component, reducing the total number of parts that need to be managed and assembled. This integration simplifies the manufacturing process by eliminating welding operations and reducing part inventory requirements, thereby decreasing manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
The patent extracts the welding operation from the manufacturing process by designing an integrated shield structure that does not require welding of separate finger parts. This removal of the welding step simplifies the manufacturing process, reduces the need for specialized welding equipment and skills, and decreases overall manufacturing complexity while preserving EMI shielding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the manufacturing costs and physical space required for electronic components, while effectively shielding against EMI, making the devices smaller, slimmer, and more productive by utilizing a flexible sheet to cover the frame structures and printed circuit board surfaces.
Implementation Method 1
A shield structure configured to surround or cover a side surface of a printed circuit board and parts of frame structures in which electronic components embedded therein are disposed
Data Source
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AI summary
Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.