Flexible Shielded Circuit Board for Foldable Bending Reliability
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Solution Overview
Problem
Circuit boards with electromagnetic shielding structures face challenges in manufacturing efficiency and cost, and they are prone to fracturing during bending, especially in foldable electronic devices, compromising signal integrity and durability.
Innovation Solution
A circuit board design with a lamination structure including a flexible non-conductive film and conductive patterns, overlaid with a coverlay containing electromagnetic shielding material, and conductive vias to connect these elements, ensuring bending flexibility and reduced manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield film is attached to the circuit board, then electromagnetic shielding performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electromagnetic shielding function directly into the circuit board structure by forming a conductive pattern on the same layer as the signal trace. This integration eliminates the need for a separate shield film attachment process, reducing manufacturing complexity while maintaining electromagnetic shielding effectiveness through the combined conductive structure.
2Reliability
If a shield film is attached to the circuit board, then electromagnetic shielding performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the shielding function with the existing circuit board fabrication process by forming the conductive pattern during the same manufacturing steps used for signal traces. This eliminates the need for additional shield film materials and attachment processes, reducing manufacturing cost while achieving the required electromagnetic shielding performance.
3Strength
If the circuit board is made rigid for structural stability, then mechanical strength is improved, but bending flexibility deteriorates
Solution Approach 1:
The patent applies local quality by making only the necessary portions of the circuit board rigid while keeping other portions flexible. The conductive pattern is formed selectively on specific layers to provide electromagnetic shielding and structural support where needed, while the overall board structure maintains bending flexibility for foldable device applications.
4Adaptability or versatility
If the circuit board is made flexible for bending applications, then bending flexibility is improved, but structural stability deteriorates
Solution Approach 1:
The patent employs composite material structure with multiple layers having different properties. The circuit board consists of flexible substrate layers combined with conductive patterns that provide both electromagnetic shielding and structural reinforcement. This composite structure enables the board to maintain structural stability while preserving the necessary bending flexibility for foldable devices.
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.