Flexible Shielding Structure for High-Density PCBs

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Solution Overview

Problem

Existing electromagnetic wave shielding structures face limitations in accommodating high integration rates of elements, shape versatility, and rework processes, particularly in semiconductor packaging, where they fail to effectively shield variously shaped components and can cause separation or deviation of elements during rework due to solder melting.

Innovation Solution

An electromagnetic wave shielding structure comprising a printed circuit board with a ground pad, a pre-molded insulating insulation member, and a conductive coating layer, where the insulation member has accommodation grooves and protrusions to fit variously shaped elements, and an adhesive portion for secure attachment, allowing for flexible shaping and easy removal without solder melting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a pressed metal shield can is used to cover elements, then electromagnetic wave shielding is achieved, but the integration rate of elements is reduced due to the fixed thickness and shape limitations

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoidintegration rate of elements

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The patent replaces the rigid pressed metal shield can with a flexible insulating material sheet that can be conformally attached to the printed circuit board. This flexible sheet can adapt to various element arrangements and shapes, enabling high integration rates while maintaining shielding effectiveness through the conductive coating layer applied on its surface.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses a composite structure consisting of an insulating material base layer combined with a conductive coating layer. This composite material provides both the flexibility and conformability of insulating materials while achieving electromagnetic wave shielding through the conductive layer, thus resolving the contradiction between shielding performance and integration rate.

Inventive Principle:

Principle #40Composite materials

2Strength

If a shield can is soldered on the printed circuit board, then secure attachment is achieved, but element separation or deviation occurs during rework due to solder melting

Engineering Contradiction:

Improveattachment strengthVSAvoidelement rework capability

Core Design Contradiction:

StrengthVSEase of repair

Solution Approach 1:

The patent introduces an insulating material sheet as an intermediary between the printed circuit board and the elements. This intermediary is attached using adhesive instead of solder, providing secure attachment while allowing easy removal and rework of elements without the risk of solder melting and causing element separation or deviation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If a pressed metal shield can is used, then electromagnetic wave shielding is achieved, but various shapes such as steps, curvatures, and three-dimensional shapes are difficult to manufacture

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoidmanufacturing flexibility for various shapes

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent replaces the rigid pressed metal shield can with a flexible insulating material sheet that can be easily formed into various shapes including steps, curvatures, and three-dimensional configurations. The sheet can be conformally attached to the printed circuit board and elements, enabling complex geometries that would be difficult and costly to manufacture using traditional metal forming processes.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state and form factor of the shielding material from rigid metal to flexible insulating sheet. This parameter change enables easy manufacturing of various shapes through cutting, folding, and conformal attachment, whereas metal shield cans require complex stamping, bending, and welding processes to achieve similar geometries.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective electromagnetic wave shielding for variously shaped components, maintains element position during rework, and reduces the size of the shielding structure, ensuring stable performance and compact design in electronic devices.

Implementation Method 1

a conductive coating layer configured to cover an exterior surface of the insulation member, in which the conductive coating layer is connected to the ground pad

Methodology Applied

Scientific EffectElectromagnetic wave shielding: Faraday Cage

Data Source

PatentUS11013155B2Electromagnetic wave shielding structure and manufacturing method therefor

Publication Date: 2021.05.18 SAMSUNG ELECTRONICS CO LTD

AI summary

Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.