Embedded Flexible Signal Connector for 3D Power Module Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power semiconductor modules face high costs and complex manufacturing processes due to the need for multiple signal connections, which are often realized through stamped metal terminals or printed circuit boards, leading to increased tooling and assembly efforts.
Innovation Solution
The use of a mechanically flexible internal electrical signal connector that can be pre-fabricated and configured in three dimensions, allowing for adjustable placement and embedding within the module's sealing material, reducing the need for complex manufacturing and providing flexible interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals made of stamped and bent metal sheets are used for signal connections, then electrical connectivity is achieved, but manufacturing costs and tooling efforts increase due to individual stamping and bending processes for multiple terminals
Solution Approach 1:
Multiple separate metal sheet terminals are merged into a single flexible printed circuit board that provides all necessary signal connections. The FPC integrates multiple signal traces, power supply lines, and ground connections in one continuous flexible substrate, eliminating the need for individual stamping and bending processes for each terminal.
Solution Approach 2:
The flexible printed circuit board serves multiple functions simultaneously: it provides signal transmission, power supply, ground reference, and mechanical support. This single multi-functional component replaces what would otherwise require multiple separate metal terminals and associated manufacturing processes.
2Ease of manufacture
If a printed circuit board is used for electrically connecting power module substrates, then material costs may be lower, but manufacturing and assembly complexity increases due to complicated connection processes and wire-bond preparation
Solution Approach 1:
The rigid printed circuit board is replaced with a flexible printed circuit board that can be bent and shaped to accommodate the three-dimensional arrangement of power semiconductor devices. This flexibility simplifies the assembly process by allowing direct routing to device terminals without requiring complex wire-bond preparation or rigid board positioning.
Solution Approach 2:
A flexible printed circuit board made from thin flexible substrate material is used instead of a rigid PCB. The flexible nature of this thin film allows it to conform to the module's internal geometry and be easily integrated during assembly, reducing manufacturing complexity while maintaining low material costs.
3Adaptability or versatility
If multiple terminals with different designs are manufactured by individual stamping and bending processes, then customized signal connections are achieved, but tooling and manufacturing efforts increase
Solution Approach 1:
The flexible printed circuit board is segmented into multiple functional regions with different trace patterns, impedance characteristics, and connection types. This allows customization of signal connections for different applications while manufacturing all segments in a single continuous process, eliminating the need for multiple tooling setups.
Data Source
Figure 1A~1B
Figure 2~3
Figure 4~5
AI summary
A power semiconductor module (100) is provided which comprises a first module part (1, 1A, 1B), a second module part (2, 2A, 2B), an internal electrical signal connector (12) and a sealing material (3). The internal electrical signal connector (12) is mechanically flexible and electrically connects at least one of the first module part (1, 1A, 1B) and the second module part (2, 2A, 2B) with at least one signal conductor (12A, 12B) of the internal electrical signal connector (12). The internal electrical signal connector (12) is at least partly embedded within the sealing material (3). Due to its mechanical flexibility, the internal electrical signal connector (12) is configurable in three dimensions in the absence of the sealing material (3) and is located at pre-designed position in three dimensions in the power semiconductor module (100). Furthermore, a method for producing a power semiconductor module (100) is provided.