Flexible Sleeve Cooling Circuit for Heat-Stressed Electronic Cavities

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Solution Overview

Problem

Current cooling solutions for high-heat electronic devices, such as gyrotrons, face challenges in achieving effective heat transfer while maintaining mechanical stability, as they are limited by thermal stress and radial expansion, and often result in non-uniform cooling and mechanical stresses due to the use of mini-canals and braze materials.

Innovation Solution

A cooling system with a heat-transport fluid circuit featuring grooves on the external surface of the internal cavity and a flexible sleeve forming mini-canals with varying thicknesses, allowing for closer proximity of the fluid to the heated surface and reducing thermal resistance, while maintaining mechanical stability through a dynamic geometry that adapts to thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the wall thickness is reduced to improve heat transfer, then the heat exchange efficiency is improved, but the mechanical stability is adversely affected due to thermal expansion

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidmechanical stability
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The cooling circuit is segmented into multiple mini-canals distributed across the wall thickness, allowing heat transfer optimization without compromising structural integrity. The segmentation enables independent thermal management zones while maintaining overall mechanical stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mini-canals are nested within the wall structure, with the cooling circuit embedded inside the wall thickness. This nesting allows the cooling fluid to be positioned close to the heated surface for efficient heat transfer while the outer wall structure maintains mechanical stability.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Device complexity

If mini-canals are implemented in a single block of material, then the structure is simplified, but the distance between mini-canals and heated wall increases causing thermal resistance

Engineering Contradiction:
Improvestructural simplicityVSAvoidthermal resistance
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The mini-canals are arranged in a three-dimensional configuration within the wall structure, allowing them to approach the heated surface from multiple directions and positions. This dimensional arrangement minimizes the distance between cooling fluid and heated wall while maintaining structural integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If rectilinear mini-canals are used, then the manufacturing is simplified, but the cooling uniformity is reduced due to inability to follow cavity curvature

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcooling uniformity
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The mini-canals are designed with curved paths that follow the contour of the cavity wall, enabling uniform heat transfer across the entire heated surface. The curved configuration allows the cooling fluid to maintain optimal distance from the heated wall throughout, improving cooling uniformity while remaining manufacturable.

Inventive Principle:
Principle #14Spheroidality (Curvature)

4Strength

If braze material is used to join cooling elements, then the mechanical strength is improved, but the thermal stress and mechanical stresses are increased

Engineering Contradiction:
Improvejoint strengthVSAvoidthermal stress
Core Design Contradiction:
StrengthVSStress or pressure

Solution Approach 1:

The cooling circuit is integrated directly into the wall structure through nesting, eliminating the need for separate joining operations. The mini-canals are formed as part of the monolithic structure, removing braze joints and their associated thermal and mechanical stresses.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat transfer efficiency, reduces thermal stress, and improves mechanical robustness by minimizing the distance between the heat-transport fluid and the heated surface, achieving a flatter temperature profile and lower mechanical stresses, while ensuring vacuumtightness and stability.

Implementation Method 1

The heat heats the fluid and is removed by the flowing of this fluid through the cooling circuit

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

the presence of a thick wall between the heated surface and the stream of heat-transport fluid limits the exchange of heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11871504B2Electronic system equipped with a heat-transport fluid cooling circuit
Publication Date: 2024.01.09 THALES SA
  • US11871504B2 patent drawing
  • US11871504B2 patent drawing
  • US11871504B2 patent drawing

AI summary

An electronic system includes an external jacket; a wall of an internal cavity that is to be cooled; at least one fixed connection fixing the external wall of the internal cavity that is to be cooled to the external jacket; a heat-transport fluid cooling circuit comprising grooves on the external surface of the wall of the internal cavity and a sleeve comprising a flexible portion positioned flush with the external surface of the external wall of the internal cavity, thereby forming mini-canals with said grooves; a radial extension of the wall of the internal cavity creating connecting points intended to hold the sleeve in place; and a space between the external jacket and the sleeve at the flexible portion of the sleeve.