Flexible Hermetic Solar Cell Package with Threaded Mount

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Solution Overview

Problem

Current solar cell package designs face challenges in durability, mechanical integrity, electrical connectivity, thermal transfer, and cost due to reliance on limited ceramic substrates and vertical stacking, which restricts package size and increases manufacturing costs, making it difficult to achieve long-term reliability and hermetic sealing.

Innovation Solution

A solar cell package with a circular base and ceramic ring forming a sealed compartment, allowing for interchangeable and replaceable components, including a hermetically sealed chamber with optical index matching fluid, and alternative embodiments with conformal coatings or external bypass diodes, featuring a threaded mount for easy assembly and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If vertical stacking of chip, thermally conductive substrates, and heat sink is used, then thermal transfer is improved, but package profile increases and hermetic sealing becomes more difficult and expensive

Engineering Contradiction:

Improvethermal transferVSAvoidpackage profile

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent transitions from vertical stacking to a planar configuration where the semiconductor chip, thermally conductive substrate, and heat sink are arranged in a substantially planar relationship. The thermally conductive substrate is coupled to the back surface of the chip, and the heat sink is coupled to the substrate, creating a lateral thermal pathway rather than a vertical stack. This dimensional change reduces the package profile height while maintaining effective thermal transfer from the chip to the heat sink.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If limited ceramic substrates (aluminum nitride and beryllium oxide) are used for thermal conduction, then thermal transfer is improved, but manufacturing cost increases due to limited suppliers

Engineering Contradiction:

Improvethermal conductionVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter of the thermally conductive substrate from limited high-cost ceramics (aluminum nitride, beryllium oxide) to a broader class of materials including metal ceramics, metal alloys, and other thermally conductive materials. This parameter change expands the pool of available suppliers and reduces manufacturing costs while maintaining adequate thermal conduction performance through the substrate layer.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If maximum platform size of 4.5 inches x 4.5 inches is used, then current manufacturing capacity is maintained, but raw materials input per unit increases

Engineering Contradiction:

Improvemanufacturing capacityVSAvoidraw materials input

Core Design Contradiction:

ProductivityVSQuantity of substance

Solution Approach 1:

The patent creates a universal platform design that can accommodate various semiconductor chip sizes and configurations within an enlarged platform area greater than 4.5 inches x 4.5 inches. This multi-functional platform can handle different chip dimensions, allowing for more efficient material utilization and reduced raw materials input per unit as the platform size increases, while maintaining compatibility with existing manufacturing processes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Reliability

If hermetic sealing is implemented to protect semiconductor material, then reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

ImprovedurabilityVSAvoidsealing structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a hermetic seal structure that creates a protected environment for the semiconductor chip and associated electronics. The seal can be implemented through various methods including conformal coatings, hermetic enclosures, or sealed edges of the substrate, providing durability and protection against environmental factors while managing the complexity of the sealing mechanism through integrated design approaches.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced durability, reliability, and cost-effectiveness by enabling larger platform sizes, reducing material input, and facilitating easy replacement and mounting, while maintaining hermetic sealing and thermal conductivity.

Implementation Method 1

The ring is raised to define a reservoir to contain an optical index matching fluid

Methodology Applied

Scientific EffectOptical index matching: Refraction

Implementation Method 2

thermally conductive substrates, and heat sink be stacked vertically

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8962989B2Flexible hermetic semiconductor solar cell package with non-hermetic option

Publication Date: 2015.02.24 CACTUS MATERIALS INC

AI summary

A device containing a solar cell chip that may include a hermetically sealed chamber containing optical matching fluid and a threaded pedestal mounting to allow for replacement of solar cell units and that are easily mountable to a master heat sink.