Flexible Electronic Component Splice Structure
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Solution Overview
Problem
Flexible electronic component modules in large-size arrays face limitations in flexibility and are prone to damage when folded due to the use of staples in splice structures, resulting in unsmooth surfaces and potential damage.
Innovation Solution
A splice structure comprising a first and second flexible electronic component module with overlapping substrates and electrode layers, where a vertical conductive layer, such as an anisotropic conductive film, is used to connect the modules, allowing for exposed portions with bump electrodes that facilitate secure and flexible connections without staples.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If staples are used to connect component modules in a splice structure, then the connection strength is improved, but the surface smoothness deteriorates and flexibility is reduced
Solution Approach 1:
The patent removes the harmful staple connection method from the splice structure and replaces it with a staple-free design using exposed portions and bump electrodes. This extraction of the problematic element (staples) eliminates the surface irregularities and flexibility limitations while maintaining connection strength through alternative means.
Solution Approach 2:
The patent introduces an intermediary connection mechanism consisting of exposed portions and bump electrodes that mediate between the first and second substrates. This intermediary structure provides both mechanical connection and electrical connectivity without the surface-damaging effects of staples, achieving smooth surfaces while maintaining structural integrity.
2Strength
If staples are used to connect component modules in a splice structure, then the connection strength is improved, but the flexibility deteriorates
Solution Approach 1:
The patent removes the rigid staple connection from the flexible electronic component module assembly, extracting the element that limits flexibility. The resulting staple-free splice structure allows the flexible modules to be folded and bent without the constraints imposed by traditional staple connections.
Solution Approach 2:
The patent employs flexible substrates with exposed portions and bump electrodes that can accommodate folding and bending. This flexible connection mechanism maintains electrical and mechanical connectivity while allowing the overall structure to adapt to different configurations, preserving the flexibility essential for flexible electronic components.
3Strength
If staples are used to connect component modules, then the connection strength is improved, but the reliability deteriorates due to susceptibility to damage during folding
Solution Approach 1:
The patent extracts the vulnerable staple connection from the system, eliminating the point of failure that occurs during folding operations. The staple-free design removes the structural weakness that caused reliability issues, allowing the flexible electronic component modules to withstand folding without damage.
Solution Approach 2:
The patent designs the splice structure with exposed portions and bump electrodes that inherently protect against damage during folding. This prior design consideration built into the connection structure prevents damage before it can occur, ensuring reliability in flexible applications where folding is necessary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the flexibility and durability of large-size arrays by providing a smooth, damage-resistant splice structure that maintains connectivity and prevents damage during folding, ensuring reliable signal transmission and structural integrity.
Implementation Method 1
a vertical conductive layer, such as an anisotropic conductive film, is used to connect the modules
Data Source
AI summary
A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.