Flexible Electronic Structure With Neutral-Plane Interconnections
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Solution Overview
Problem
Flexible electronic structures face challenges with mechanical bending stresses due to thick and stiff electronic components, leading to strain on bonding interfaces and reduced lifetime, and existing solutions require individual thinning of components, which is impractical for industrial scale production.
Innovation Solution
A flexible electronic structure comprising multiple polymer or glass films with electronically conductive tracks and interconnection elements positioned near the neutral plane, along with a discontinuous compensation layer to distribute mechanical stresses, allowing for bending without breaking and maintaining the integrity of bonding interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thick and stiff electronic components are used, then component strength and availability are improved, but bending stresses cause strain on bonding interfaces and reduce structure lifetime
Solution Approach 1:
The patent positions the bonding interfaces at the neutral plane of the flexible structure, which is a specific spatial location that experiences minimal bending stress. By moving the bonding interfaces from the traditional surface location to this intermediate plane, the structure achieves both strong bonding and resistance to bending-induced failure.
Solution Approach 2:
The patent creates a local region at the neutral plane where bonding interfaces are positioned, giving this specific location different mechanical properties (minimal stress exposure) compared to other parts of the structure. This localized positioning strategy protects the bonding interfaces while allowing the rest of the structure to remain flexible.
2Reliability
If ultra-thin chips are used to improve flexibility, then bending resistance is improved, but individual thinning is not industrially feasible and component availability is reduced
Solution Approach 1:
The patent changes the critical parameter from component thickness to bonding interface position. Instead of requiring ultra-thin components (which are difficult to manufacture), the invention achieves flexibility by positioning bonding interfaces at the neutral plane, a parameter that can be controlled during the manufacturing process without requiring component thinning.
Solution Approach 2:
The patent extracts the flexibility requirement from the electronic components themselves and relocates it to the structural design (neutral plane positioning). This separates the flexibility function from the component thickness, allowing standard-thickness components to be used while still achieving the desired flexible structure.
3Ease of manufacture
If metal tracks and contact points are positioned at the surface, then electrical connection is simplified, but bending and torsional stresses weaken them and reduce lifetime
Solution Approach 1:
The patent moves the metal tracks and contact points from the traditional surface location to the neutral plane, creating a new spatial arrangement. This dimensional repositioning protects the electrical connections from bending and torsional stresses while maintaining their electrical functionality.
Data Source
AI summary
A flexible electronic structure includes a first film, made of a first polymer or glass, and a second film, made of a second polymer, in which at least one electronic component is arranged. The second film covers the first film. The flexible electronic structure also includes at least one electrically conductive track arranged between the first film and the second film, and each electrically connected to one of the electronic components, by a respective interconnection element. Optionally, the flexible electronic structure includes a third film, made of a third polymer or glass, covering the second film. The interconnection element is arranged near the neutral plane of the structure, and the structure includes at least one compensation layer, so as to position the neutral plane at a desired location.