Flexible Substrate Carrier Adhesion Control
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Solution Overview
Problem
The production of flexible electronic devices, such as flexible displays, faces challenges in preventing misalignment of electronic elements due to substrate distortion during processing, which existing techniques like prolonged baking do not adequately address.
Innovation Solution
A method involving securing a flexible substrate to a carrier using dual adhesive elements with different temperature-sensitive adhesion strengths, allowing for controlled release without distortion or damage, and enabling the reuse of the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flexible substrate is processed without a carrier, then the substrate remains flexible and accessible, but the substrate distorts during processing causing misalignment of electronic elements
Solution Approach 1:
A rigid carrier is introduced as an intermediary substrate to support the flexible substrate during processing. The rigid carrier provides dimensional stability and prevents distortion, serving as a mediator between the flexible substrate and the processing equipment. This allows precise alignment of electronic elements while the flexible substrate maintains its inherent flexibility for the final application.
2Manufacturing precision
If a substrate is securely adhered to a carrier during processing, then alignment precision is improved, but the substrate cannot be released without damage or residue
Solution Approach 1:
The adhesive system transitions from a static strong-bond model to a dynamic, controllable adhesion system. The adhesive layer's bond strength can be modulated through temperature control or other stimuli, allowing it to be strong during processing for precise alignment, then become releasable after processing by changing the adhesive properties through heating or other triggers.
Solution Approach 2:
The adhesion strength of the adhesive layer is changed by modifying physical parameters such as temperature. During processing, the adhesive maintains strong bonding at processing temperatures, but after processing, heating or other parameter changes reduce the adhesion strength to enable clean release of the substrate from the carrier without damage or residue.
3Device complexity
If a single adhesive element is used to secure the substrate to the carrier, then the structure is simple, but the adhesive must balance strong bonding with easy release
Solution Approach 1:
The single adhesive element is segmented into multiple functional layers with distinct properties. This includes a first adhesive layer for strong bonding to the carrier, a release layer with controllable adhesion for clean substrate release, and potentially a second adhesive layer for substrate attachment. Each layer performs a specific function, making the overall system more reliable than a single-layer adhesive attempting to perform all functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces misalignments, improves yield, facilitates high-resolution display production, and lowers manufacturing costs by minimizing alignment requirements through precise control of adhesion strength reduction.
Implementation Method 1
reducing the adhesion strength of the adhesive layer between the support element and said one of the substrate and the carrier by heating the adhesive unit to a first temperature, and reducing the adhesion strength of the adhesive layer between the support element and the other of the substrate and the carrier by heating the adhesive unit to a second temperature higher than the first temperature
Data Source
AI summary
A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.