Flexible Substrate Package with Low-Outgassing Adhesive Barrier
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Solution Overview
Problem
Flexible substrates used in electronic devices are prone to high temperature intolerance, poor water and oxygen resistance, and vapor permeation, leading to reduced device lifespan and inability to meet commercial demands.
Innovation Solution
An environmental sensitive element package is designed with a first substrate, a second substrate, a barrier structure, and an adhesive, where the barrier structure is distributed outside the environmental sensitive element and the adhesive has low outgassing characteristics to prevent vapor and oxygen permeation, using materials like stainless steel, glass, or plastic for superior resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If flexible substrates are used in electronic devices, then flexibility and portability are improved, but water and oxygen resistance deteriorates
Solution Approach 1:
The patent employs a composite encapsulation structure consisting of multiple layers including flexible substrate, adhesive layers, and inorganic barrier layers. This composite structure combines the flexibility of organic materials with the barrier properties of inorganic materials, achieving both flexibility and water/oxygen resistance simultaneously.
Solution Approach 2:
The patent uses flexible substrate materials such as polyimide (PI) or polyester (PET) as the base layer, and applies thin film encapsulation layers to provide barrier functionality while maintaining the overall flexibility of the device structure.
2Ease of operation
If flexible substrates are used in electronic devices, then portability is improved, but vapor permeation increases
Solution Approach 1:
The patent combines flexible organic substrates with inorganic barrier layers forming a composite structure that blocks vapor permeation while preserving portability. The multi-layer composite effectively prevents vapor transmission that would otherwise occur through flexible materials.
Solution Approach 2:
The barrier structure is selectively applied where vapor permeation is a concern, with inorganic barrier layers positioned specifically to block vapor pathways while maintaining flexibility in other areas of the substrate.
3Ease of manufacture
If conventional encapsulation is used, then manufacturing simplicity is maintained, but device lifespan reduces due to permeation
Solution Approach 1:
The patent implements a multi-layer composite encapsulation structure with flexible substrates, adhesive layers, and inorganic barrier layers. This composite approach provides superior long-term protection against permeation while remaining compatible with existing manufacturing processes.
Solution Approach 2:
The patent introduces adhesive layers as intermediary components between the flexible substrate and the barrier structure, ensuring proper bonding and sealing while maintaining the integrity of the encapsulation system throughout the device lifespan.
4Reliability
If barrier structure is added outside environmental sensitive element, then vapor and oxygen resistance is improved, but device complexity increases
Solution Approach 1:
The patent merges the barrier function with the encapsulation structure by integrating inorganic barrier layers directly into the existing multi-layer package structure, rather than adding separate external barrier components. This reduces overall device complexity while maintaining vapor and oxygen resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package achieves enhanced vapor and oxygen resistance, extending the lifespan of electronic devices and meeting commercial demands by effectively blocking permeation and maintaining device integrity.
Implementation Method 1
an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2
Implementation Method 2
Typical flexible substrates can not block the permeation of vapor and oxygen completely
Data Source
AI summary
A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2.