Flexible Substrate Aerogel Buffer Layer Laser Lift-Off
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Solution Overview
Problem
The air pressure generated during the separation of a flexible substrate from a glass substrate in the laser lift-off process can cause wrinkling or cracking due to the impact on the flexible substrate.
Innovation Solution
A method involving the formation of a first aerogel layer with a cross-linked and nanoporous structure, an inorganic layer with columnar structures, and a second flexible substrate layer, which are then peeled using a laser lift-off process to form a flexible substrate, providing cushioning against air pressure and enhancing flexibility and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser lift-off process is used to separate the flexible substrate from the glass substrate, then the flexible substrate can be successfully separated from the substrate, but the air pressure generated during separation causes the flexible substrate to wrinkle or crack
Solution Approach 1:
The patent introduces a buffer layer between the flexible substrate and the glass substrate that is specifically designed to absorb and dissipate the air pressure generated during the laser lift-off process. This buffer layer prevents the flexible substrate from experiencing direct impact from the generated air pressure, thereby preventing wrinkling and cracking while still allowing successful separation.
Solution Approach 2:
The buffer layer serves as an intermediary element between the flexible substrate and the glass substrate. It mediates the interaction by absorbing the harmful air pressure effects during the separation process, allowing the separation to occur successfully without transmitting damaging forces to the flexible substrate.
2Adaptability or versatility
If the flexible substrate is made thinner to improve flexibility, then the bendable performance is enhanced, but the substrate becomes more susceptible to wrinkling and cracking under air pressure
Solution Approach 1:
The buffer layer provides beforehand cushioning that protects thin flexible substrates from the air pressure generated during separation. This allows the substrate to be made thinner for improved flexibility while the buffer layer prevents the thin substrate from wrinkling or cracking under pressure.
Solution Approach 2:
The buffer layer is designed with a porous structure that allows it to absorb and dissipate air pressure through its porous matrix. This porous structure enables the buffer layer to cushion the flexible substrate from pressure impacts while maintaining breathability and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively absorbs kinetic energy from air pressure, preventing wrinkling or cracking and improving the yield and stability of the flexible substrate, while also enhancing its bendable performance and adhesion between layers.
Implementation Method 1
The first aerogel layer has a cross-linked structure and a nanoporous structure... effectively absorbs kinetic energy from air pressure
Implementation Method 2
the first aerogel layer has a cross-linked structure and a nanoporous structure
Implementation Method 3
irradiating laser to a bottom surface of the glass substrate to ablate the polyimide at an interface between the flexible substrate and the glass substrate
Implementation Method 4
ablate the polyimide at an interface between the flexible substrate and the glass substrate
Implementation Method 5
performing a curing treatment on the polyamic acid gel film to obtain the first aerogel layer... thermal imidization curing treatment
Data Source
AI summary
A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.