Flexible Substrate Auxiliary Layer for Static-Free Support Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing flexible substrates and display devices face challenges in efficiently removing supports without generating static electricity, which can damage the devices and increase manufacturing costs, especially when using lasers.
Innovation Solution
A method involving the formation of an auxiliary layer with a silicon-containing material and gold particles on a support, followed by the deposition of a polymer thin film, and subsequent removal of the support without laser use, utilizing a physical method to prevent static electricity and enhance adherence for easy detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser is used to remove the support, then the support can be removed efficiently, but static electricity is generated which can damage the device and increase manufacturing costs
Solution Approach 1:
An auxiliary layer is introduced as an intermediary between the support and the polymer thin film. This auxiliary layer enables the support to be removed physically without generating static electricity, while still allowing efficient support removal. The auxiliary layer acts as a mediator that facilitates the separation process harmlessly.
Solution Approach 2:
The auxiliary layer is extracted and removed along with the support after serving its purpose of enabling easy detachment. This allows the support to be removed efficiently while the auxiliary layer prevents static electricity generation during the removal process.
2Device complexity
If the polymer thin film is formed directly on the support, then the manufacturing process is simpler, but the support cannot be easily removed without generating static electricity
Solution Approach 1:
The interface between the support and polymer thin film is segmented by introducing an auxiliary layer. This segmentation allows the support to be easily removed through physical methods without direct contact between the support and polymer thin film, preventing static electricity generation while maintaining manufacturing simplicity.
3Object-affected harmful factors
If the support is removed using a physical method without laser, then static electricity is prevented, but the support removal process becomes more complex
Solution Approach 1:
The auxiliary layer serves as a mediator that enables physical support removal without requiring complex laser systems. By introducing this intermediate layer, the support removal process becomes simpler while still preventing static electricity generation through physical methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents static electricity generation during support removal, ensures reliable device operation, and reduces manufacturing costs by simplifying the process and improving the flexibility of the substrate and display devices.
Implementation Method 1
The silicon-containing material may include a thiol group at a terminal end thereof
Data Source
AI summary
A method of manufacturing a flexible substrate includes providing a support, forming an auxiliary layer including a silicon-containing material and a gold (Au) particle on the support, forming a polymer thin film on the auxiliary layer, and removing the support after forming the polymer thin film.