Flexible Substrate With Patterned Bending Resistant Structures

The substrate is divided into multiple functional layers including first and second flexible layers, barrier layers, buffer layers, and bending resistant structures. Each layer serves a specific function, with the bending resistant structures providing mechanical support while the flexible layers maintain flexibility. This segmentation allows the substrate to achieve both flexibility and bending resistance through coordinated layer functions.

The substrate employs a composite structure combining materials with different mechanical properties. The flexible layers provide elasticity and flexibility, while the bending resistant structures provide mechanical strength and recovery ability. The barrier and buffer layers add protective functions. This composite approach enables the substrate to simultaneously achieve flexibility, bending resistance, and structural integrity.

The bending resistant structures are pre-formed within the barrier and buffer layers before final assembly. The barrier layers and buffer layers are deposited with predetermined thicknesses (400-600nm) to ensure proper mechanical support. This preliminary formation of structural elements during manufacturing ensures the substrate achieves the required recovery ability while maintaining a streamlined production process.

The patent optimizes specific parameters such as layer thicknesses (barrier layer: 400-600nm, buffer layer: 400-600nm, bending resistant structure: 100-150nm) and distances between structures (150-250nm from flexible layer, 200-450nm from opposite side) to achieve the desired balance between manufacturing ease and mechanical performance. These parameter optimizations ensure reliable recovery ability without overly complicating the manufacturing process.