Flexible Substrate Bonding Filler for Crack Prevention
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Solution Overview
Problem
High-resolution flexible display panels, such as AMOLEDs, face yield reduction due to cracks in the bonding area caused by temperature stress and polyimide deformation during high-temperature and high-pressure processes.
Innovation Solution
A flexible substrate with a wiring bonding structure featuring two rows of bonding wirings and a filler, such as a polyimide film, is used to fill gaps between the wirings and dummy leads, reducing height differences and preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If high-resolution flexible display panels are manufactured with double-row bonding wiring structure, then space utilization is improved, but cracks occur in the bonding area due to temperature stress and polyimide deformation
Solution Approach 1:
A filler material is introduced as an intermediary substance between the bonding wirings and the polyimide substrate. This filler acts as a stress buffer that absorbs and distributes temperature stress and polyimide deformation, preventing direct stress concentration on the bonding wirings and eliminating crack formation while maintaining the compact double-row structure
Solution Approach 2:
The filler material is placed in advance between the bonding wirings and the substrate to provide preemptive stress cushioning. This pre-positioned cushioning layer absorbs thermal expansion and contraction forces before they can transmit to the bonding wirings, preventing cracks before they occur during high-temperature processing
2Reliability
If filler material is added between bonding wirings, then crack resistance is improved, but device complexity increases
Solution Approach 1:
The filler material is applied locally only in the critical bonding area between adjacent rows of bonding wirings, rather than throughout the entire substrate. This localized application provides crack resistance precisely where stress concentration occurs most frequently, without adding unnecessary complexity to other areas of the device
Data Source
AI summary
The present disclosure provides a flexible substrate and a display device. The flexible substrate includes a flexible base substrate, and a wiring bonding structure disposed on the flexible base substrate and including a plurality of bonding leads. A filler is arranged between the bonding leads.