Bubble Removal in Flexible Substrates via Thermal Gradient

The patent applies different temperatures to different regions of the polyimide layer. The bottom surface is heated to a higher temperature (first temperature) to promote evaporation of volatile substances, while the top surface is cooled to a lower temperature (second temperature) to prevent damage. This local quality differentiation allows effective bubble removal without substrate damage.

The patent changes the temperature parameter across the thickness of the polyimide layer. By maintaining a temperature gradient where the bottom surface is at a higher temperature and the top surface is at a lower temperature, the patent optimizes the evaporation process while protecting the substrate from thermal damage.

The patent implements local quality by applying different temperatures to different regions. The bottom surface receives higher heating power to promote evaporation, while the top surface receives cooling to maintain precise temperature control and prevent excessive heat loss.

The patent utilizes thermal gradients to control the behavior of volatile substances. By creating a temperature difference between the bottom and top surfaces, the patent promotes upward movement of evaporated gases while maintaining overall temperature control precision.