Flexible Substrate Mounting Package for High-Frequency Signal Stability
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Solution Overview
Problem
Existing electronic component mounting packages face challenges in accommodating high-frequency electronic components, particularly in maintaining reliable connections and reducing stress due to thermal expansion differences and ensuring stable frequency characteristics during high-frequency signal transmission.
Innovation Solution
The package includes a housing with a concave portion and a notched portion, a coaxial connector with a terminal and sealing member, and a flexible substrate that abuts on a projecting ridge, ensuring proper alignment and reducing stress through thermal expansion matching and impedance control, while maintaining desired frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid substrate is used for mounting high-frequency electronic components, then structural stability is improved, but stress concentration and connection reliability deteriorate due to thermal expansion differences
Solution Approach 1:
The patent employs a flexible substrate instead of a rigid substrate to mount high-frequency electronic components. The flexible substrate can elastically deform to accommodate thermal expansion differences between components and the substrate, reducing stress concentration at connection points. This maintains structural stability while preventing connection failure due to thermal stress, directly resolving the contradiction between structural stability and connection reliability.
2Reliability
If the substrate is made more flexible to reduce stress, then connection reliability is improved, but frequency characteristics deteriorate due to substrate deformation
Solution Approach 1:
The patent applies local quality by designing the flexible substrate with different regional properties: the mounting area for electronic components has optimized flexibility to reduce stress, while the signal transmission areas maintain controlled impedance and minimal deformation. The substrate's flexibility is locally tailored to achieve both connection reliability and stable frequency characteristics without mutual interference.
3Ease of manufacture
If the housing structure is simplified for ease of manufacture, then manufacturing cost is reduced, but stress distribution and connection stability worsen
Solution Approach 1:
The housing is segmented into multiple functional portions: a main housing body, a cover portion, and a recess portion. This segmentation allows each part to be manufactured independently with optimized structures for their specific functions, then assembled together. The recess portion specifically accommodates the flexible substrate, providing structural support while allowing the substrate to maintain its flexibility for stress relief, thus achieving both manufacturing ease and connection stability.
Data Source
AI summary
An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.