Flexible Substrate with Comb-Like Protrusions for LED Mounting

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Solution Overview

Problem

Existing mounting methods for LEDs in ring lighting systems face challenges with increased LED density, leading to interference, stress in soldered joints, and poor positional accuracy, particularly when using shell-shaped LEDs with integral structures, which complicates the manufacturing process and increases costs.

Innovation Solution

A flexible substrate with a stripe-shaped substrate main body and a comb-like portion of protrusions allows for accurate placement of electronic devices like LEDs on the protrusions, which can be bent to fit conical surfaces, reducing stress and interference, and using a chassis with a cylindrical and conical portion to secure the substrate, enabling precise angular positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the density of mounted LEDs is increased, then the lighting system performance is improved, but the LEDs interfere with each other and it becomes difficult to bend the flexible substrate

Engineering Contradiction:
ImproveLED mounting densityVSAvoidsubstrate bending ease
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The flexible substrate is divided into multiple independent regions, each containing a limited number of LEDs. This segmentation prevents excessive LED density in any single area, reducing interference between LEDs while maintaining overall high mounting capacity across the entire substrate structure.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the density of mounted LEDs is increased, then the lighting system performance is improved, but stress is generated in the soldered joint causing cracks and bad electrical contact

Engineering Contradiction:
ImproveLED mounting densityVSAvoidsoldered joint reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By dividing the substrate into multiple regions with fewer LEDs each, the mechanical stress on individual soldered joints is reduced. This segmentation prevents the accumulation of stress that would otherwise lead to cracks and electrical contact failures, thereby improving joint reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate design incorporates stress distribution features and flexible mounting structures that preemptively cushion the mechanical stress on soldered joints before it can accumulate to critical levels. This prior cushioning prevents crack formation and maintains electrical contact integrity.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Adaptability or versatility

If a C-shaped flexible substrate with a notch is used to fit a conical surface, then the substrate can be mounted on inclined surfaces, but the structure becomes complicated and manufacturing cost increases

Engineering Contradiction:
Improvemounting adaptability to inclined surfacesVSAvoidsubstrate structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The flexible substrate is designed with inherent flexibility and elasticity, allowing it to dynamically adapt to conical and inclined surfaces through elastic deformation rather than requiring complex rigid notches or shapes. This dynamic adaptation maintains mounting versatility while simplifying the substrate structure.

Inventive Principle:
Principle #15Dynamics

4Ease of manufacture

If shell-shaped LEDs with integral structure are used, then electrical connection is achieved by inserting lead wires into through-holes, but the shell-shaped lens oscillates the head causing bad positional accuracy

Engineering Contradiction:
Improveelectrical connection easeVSAvoidLED positional accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The substrate includes pre-formed positioning structures and guide features that preliminarily establish the correct LED position and orientation before the soldering process. These pre-positioning mechanisms prevent head oscillation during mounting, ensuring high positional accuracy while maintaining ease of electrical connection.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8651699B2Flexible substrate, mounting method of flexible substrate, and lighting system
Publication Date: 2014.02.18 SONY GROUP CORP
  • US8651699B2 patent drawing
  • US8651699B2 patent drawing
  • US8651699B2 patent drawing

AI summary

A flexible substrate includes a stripe-shaped substrate main body portion; a comb-like portion composed of a plurality of protrusions that extends from one end in the direction perpendicular to the longitudinal direction of the substrate main body portion, in the direction perpendicular to the longitudinal direction; and electronic devices that are arranged on the plurality of protrusions, respectively, in which the substrate main body portion and the comb-like portion are bendable.