Flexible Substrate Composition Using Nanoscale Ceramic Particles
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Solution Overview
Problem
Existing substrates for electronic devices lack flexibility and high dielectric constant with low dielectric loss, making them unsuitable for advanced flexible electronic applications such as soft printed circuit boards and RF modules.
Innovation Solution
A composition comprising SrTiO3 and/or Ba(Sr)TiO3 ceramic particles, flexible macromolecules with specific functional groups, and a thermosetting organic resin, which provides a high dielectric constant, low dielectric loss, and high flexibility, suitable for flexible substrate fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional dielectric materials (epoxy, barium titanate particles) are used to achieve high dielectric constant, then the dielectric constant increases, but the substrate loses flexibility and becomes brittle
Solution Approach 1:
The patent changes the particle size parameter of the ceramic filler to nanometer scale (30-200 nm), which fundamentally alters the material properties. This nanoscale dimension enables the dielectric particles to be embedded within the polymer matrix without creating stress concentration points that would cause brittleness, thus achieving both high dielectric constant and flexibility simultaneously
Solution Approach 2:
The patent creates a composite material system combining nanoscale ceramic particles (SrTiO3, Ba(Ti,Zr)O3, or Ba(Sr)TiO3) with flexible polymer matrices (polyimide, polyether sulfone, polyester, or polyvinylidene fluoride). This composite structure allows the ceramic particles to provide high dielectric constant while the polymer matrix maintains flexibility, resolving the contradiction between dielectric performance and mechanical flexibility
2Length of stationary object
If high dielectric constant materials are used, then the dielectric constant increases, but dielectric loss increases and temperature stability deteriorates
Solution Approach 1:
The patent optimizes the particle size parameter to the nanometer range (30-200 nm), which reduces dielectric loss by eliminating grain boundary effects and reducing defect density that occur in larger particles. The nanoscale dimensions also improve temperature stability by reducing thermal expansion differences and enhancing the overall thermal stability of the composite material
Solution Approach 2:
The patent employs a dual-component ceramic system where SrTiO3 or Ba(Ti,Zr)O3 particles provide high dielectric constant, while Ba(Sr)TiO3 particles contribute to temperature stability and low dielectric loss. This local specialization of different ceramic components allows the composite to achieve low dielectric loss and temperature stability while maintaining high overall dielectric constant
3Strength
If flexible polymers are used to achieve flexibility, then flexibility improves, but dielectric constant decreases
Solution Approach 1:
The patent creates a composite where flexible polymer matrices (polyimide, polyether sulfone, polyester, or polyvinylidene fluoride) provide flexibility and mechanical strength, while nanoscale ceramic particles (SrTiO3, Ba(Ti,Zr)O3, or Ba(Sr)TiO3) dispersed within the matrix provide high dielectric constant. The nanoscale dispersion ensures uniform electrical properties without compromising the polymer's flexibility
Solution Approach 2:
The patent assigns different functional roles to different components: the polymer matrix provides flexibility and mechanical integrity, while the embedded nanoscale ceramic particles locally provide high dielectric constant. This functional differentiation allows the material to simultaneously exhibit both flexibility and high dielectric constant without compromise
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a high dielectric constant of 6-60 and low dielectric loss of 0.003-0.03 at frequencies over 1 GHz, with a glass transition temperature above 180°C, enabling flexible substrates for applications like printed circuit boards and RF modules with improved mechanical strength and processing capabilities.
Implementation Method 1
SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition
Implementation Method 2
a glass transition temperature above 180°C
Data Source
AI summary
A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.