Flexible Substrate Conductive Bridge for Thin Electronic Devices
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Solution Overview
Problem
Existing electronic device manufacturing technologies face challenges in reducing the thickness and volume of devices while maintaining effective electrical signal transmission across flexible substrates.
Innovation Solution
The method involves forming a through hole in a flexible substrate, creating a conductive bridge within this hole, and forming an opening on a supporting substrate that corresponds to the through hole, allowing for electrical connection between components on both surfaces of the flexible substrate without increasing the device's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional manufacturing methods are used for electronic devices, then device functionality is achieved, but device thickness and volume cannot be reduced
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical connections by forming conductive bridges through holes penetrating the flexible substrate. This dimensional change allows electrical signals to transmit between top and bottom surfaces without increasing lateral footprint, thereby reducing device thickness while maintaining signal transmission reliability
Solution Approach 2:
The patent embeds conductive bridges within holes formed in the flexible substrate, nesting the conductive elements inside the substrate structure. This nesting approach allows electrical connections to be integrated within the substrate thickness rather than adding external connection layers, reducing overall device volume while maintaining functionality
2Volume of stationary object
If flexible substrate is used to reduce device thickness, then device volume is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the flexible substrate into multiple regions with through holes formed at specific locations. By segmenting the substrate and forming discrete conductive bridges at targeted positions, the manufacturing process can systematically handle the complexity through localized processing steps rather than attempting to modify the entire substrate uniformly
Solution Approach 2:
The patent introduces conductive bridges as intermediary elements that facilitate electrical connections between components on opposite sides of the flexible substrate. These conductive bridges act as mediators that simplify the overall manufacturing process by providing dedicated connection pathways, reducing the need for complex lateral routing and simplifying the integration of flexible substrate-based components
Data Source
AI summary
An electronic device provided herein includes an insulation layer having a first space; a conductive element disposed in the first space of the insulation layer; a substrate corresponded to the insulation layer; a metal layer disposed between the insulation layer and the substrate; and an electronic component corresponded to the substrate. The substrate has a second space corresponds to the conductive element. The electronic component is electrically connected to the metal layer and the conductive element.