Flexible Substrate Connecting Portions for Electro-Optical Devices
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Solution Overview
Problem
Conventional electro-optical devices, such as liquid crystal display devices, face challenges in reducing size and thickness due to the need for bending flexible substrates, which can lead to positional deviations of light sources and weak bonding stresses, making it difficult to secure sufficient mounting areas for wiring and components.
Innovation Solution
The electro-optical device employs a flexible substrate with distinct connecting portions on opposite surfaces, allowing for accurate positioning of components without bending, thereby reducing device size and thickness, and improving display quality by eliminating positional deviations and increasing bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the flexible substrate is bent to arrange the light source on the light receiving surface of the optical waveguide, then the light source can be positioned on the light receiving surface, but the thickness of the electro-optical device increases due to the bent portion
Solution Approach 1:
The patent transitions from a planar flexible substrate to a three-dimensional folded substrate structure. By folding the flexible substrate at specific angles (e.g., 90 degrees) to form multiple layers, the light source can be positioned on the light receiving surface without requiring a large bent portion that increases device thickness. This dimensional transformation allows precise positioning while maintaining a compact overall thickness.
2Manufacturing precision
If the flexible substrate is bent to arrange the light source, then the light source can be mounted, but the length of the flexible substrate becomes larger
Solution Approach 1:
The flexible substrate is folded to form a multi-layer structure where the light source is positioned on the light receiving surface. This folding approach uses vertical space rather than extending the substrate length horizontally, thereby achieving precise positioning without significantly increasing the overall substrate length.
Solution Approach 2:
The flexible substrate is folded back onto itself, creating a nested multi-layer structure. The light source is mounted on an inner layer that is folded to position it precisely on the light receiving surface, while outer layers provide structural support and routing for wiring lines. This nesting approach minimizes the overall length requirement.
3Manufacturing precision
If the flexible substrate is bent, then the light source can be positioned, but the bonding stress becomes weak and detachment may occur
Solution Approach 1:
Instead of using a gradual bend that creates weak bonding stress, the patent employs sharp folds at specific angles (e.g., 90 degrees) to position the light source. These folded structures create rigid angular joints that provide stronger mechanical support and more reliable bonding, preventing detachment while achieving precise positioning.
4Volume of moving object
If the bent region is made narrow to reduce size, then the device size decreases, but it becomes difficult to secure sufficient area for wiring lines and electronic components
Solution Approach 1:
The flexible substrate is folded to form multiple layers, creating three-dimensional space for mounting wiring lines and electronic components. This multi-layer structure provides sufficient mounting area within a compact footprint, as wiring and components can be distributed across different layers rather than competing for space on a single narrow plane.
Solution Approach 2:
The folded flexible substrate creates nested layers that provide multiple mounting surfaces. Wiring lines and electronic components can be mounted on different layers of the folded structure, effectively utilizing the vertical space to secure sufficient area for all necessary elements while maintaining a small overall device size.
5Area of stationary object
If the flexible substrate is made larger to secure sufficient area, then wiring and components can be mounted, but the device size increases
Solution Approach 1:
The patent uses a folded multi-layer structure to provide sufficient mounting area for wiring lines and electronic components without increasing the device footprint. By utilizing the vertical dimension through folding, the design accommodates all necessary elements within a compact size.
Data Source
AI summary
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting portion that is arranged on one surface of the substrate; and a second connecting portion that is arranged on the other surface of the substrate.