Flexible Substrate Connection Sealing for Vehicle Wiring Modules
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Solution Overview
Problem
The existing configuration of battery modules for electric or hybrid vehicles requires a complex and large structure to ensure waterproofing, leading to an increased number of components and complexity.
Innovation Solution
A substrate connection structure using a flexible substrate with a conductive path and a circuit board, where the connection between the substrate and circuit board is covered by an insulating resin, simplifying the configuration and reducing the number of components while maintaining waterproofness and dustproofness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plug member is used to seal the gap between the case body and the drawn-out substrate portion, then waterproofness is improved, but the structure becomes large and complex with increased number of components
Solution Approach 1:
The patent merges the sealing function with the connection structure itself. The insulating resin covering portion integrates both the protective covering function and the sealing function, eliminating the need for a separate plug member. The resin material fills and seals the gap between the case body and the drawn-out substrate portion while providing electrical insulation and environmental protection.
Solution Approach 2:
The insulating resin covering portion serves multiple functions simultaneously: it provides electrical insulation between conductive paths, seals the gap for waterproofing and dustproofing, protects the connection interface, and provides mechanical support. This multi-functional design replaces the single-function plug member while achieving superior performance.
2Reliability
If a plug member is used to seal the gap between the case body and the drawn-out substrate portion, then waterproofness is improved, but the number of components increases
Solution Approach 1:
The patent combines the sealing function with the insulating resin covering that already exists for electrical insulation purposes. By making the covering portion extend to seal the gap between the case body and the drawn-out substrate portion, the design eliminates the need for a separate plug member, thereby reducing the total component count while maintaining effective waterproofing.
3Reliability
If the inside of the case body is completely waterproofed with the plug member, then waterproofness is improved, but the structure becomes large
Solution Approach 1:
The patent applies local quality by providing waterproofing precisely where needed - at the connection interface between the flexible substrate and the circuit board, and at the gap between the case body and the drawn-out substrate portion. The insulating resin covering is applied locally to these critical areas rather than requiring complete waterproofing of the entire case body interior, thus avoiding unnecessary volume increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the structure and reduces the number of components while ensuring effective waterproofness and dustproofness, particularly protecting the electrically connected portions from short-circuiting.
Implementation Method 1
a connected portion between the first land and the second land is covered by a covering portion that is constituted by a resin having an insulating property
Data Source
AI summary
A wiring module 20 is included in a power storage module 2 including a plurality of power storage elements 10 each having electrode terminals 11A and 11B and is connected to the power storage elements 10. The wiring module 20 includes a flexible FPC 21A including a first conductive path 23 and a circuit board 30 including a second conductive path that is electrically connected to the first conductive path 23. The FPC 21A includes a main body portion 24 and a circuit connecting portion 27 that extends from the main body portion 24 and is overlaid on the circuit board 30. The first conductive path 23 includes a first land 23A included in the circuit connecting portion 27. The second conductive path includes a second land 32A that is electrically connected to the first land 23A. The connected portion between the first land 23A and the second land 32A is covered by a covering portion 60 constituted by a resin having insulating properties.