Flexible Substrate Curvature for Compact Electronic Apparatus Connections
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Solution Overview
Problem
The increasing number of connection points between wiring layers on a hard substrate and a flexible substrate complicates the reduction of the overall size of electronic apparatuses, as it requires more surface space for soldering.
Innovation Solution
An electronic apparatus design that includes a hard substrate with terminals on multiple surfaces and a flexible substrate with corresponding terminals, where the flexible substrate is curved to apply a restoring force, allowing for a more secure and compact connection using a reduced amount of solder, and enabling the manufacturing of the hard substrate by forming through holes in a base material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of connection points between wiring layers is increased, then the electrical connection capability is improved, but the space required for soldering on the hard substrate surface increases
Solution Approach 1:
The patent utilizes the end surface of the hard substrate (a different spatial dimension from the top surface) to provide additional connection points. By forming through-holes that pass through the hard substrate and making connections at the end surface, the design achieves more electrical connections without consuming additional top surface area, thus resolving the contradiction between connection capability and soldering space.
2Stability of the object's composition
If the flexible substrate is curved to apply restoring force, then the connection stability is improved, but the manufacturing complexity increases
Solution Approach 1:
The flexible substrate is designed with a curved configuration that applies restoring force to enhance connection stability. The curvature allows the substrate to exert elastic force on the hard substrate, ensuring firm contact and stable electrical connections. This geometric solution achieves stability improvement while maintaining manufacturing feasibility through standard curved substrate fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a reduction in the overall size of electronic apparatuses while maintaining component mounting space on the hard substrate, reducing the number of parts and space required for connecting wiring layers, and enhancing the stability of the connection between the substrates.
Implementation Method 1
the flexible substrate is curved so that the third surface applies a restoring force to the first surface of the hard substrate
Implementation Method 2
The terminal of the first wiring layer provided on the first surface of the hard substrate and the terminal of the fourth wiring layer provided on the fourth surface of the flexible substrate are electrically connected by solder
Data Source
AI summary
An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.