Flexible Substrate With Deformed Portion For Optical Packaging
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Solution Overview
Problem
Conventional flexible substrates used for connecting optical communication semiconductor packages face functional failure due to bending stress-induced breaks or pinholes in patterned electric circuit lines when folded during packaging, leading to electrical opens.
Innovation Solution
A flexible substrate with a base substrate layer, a front-side pattern layer, and a back-side pattern layer, featuring a concave deformed portion in the thickness direction, which reduces bending stress and prevents breaks or pinholes in the patterned electric circuit lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the flexible substrate is folded during packaging, then the substrate can be soldered to the package, but bending stress causes breaks or pinholes in the patterned electric circuit lines leading to electrical opens
Solution Approach 1:
The patent applies local quality by creating a deformed portion with different structural characteristics from the rest of the substrate. This deformed portion has reduced thickness and different mechanical properties, allowing it to accommodate bending stress during folding while the rest of the substrate maintains its structural integrity and electrical continuity.
Solution Approach 2:
The deformed portion is formed in advance during the substrate manufacturing process, before the folding operation. This preliminary deformation creates a pre-compressed or pre-stressed region that can absorb subsequent bending stresses, preventing damage to the electric circuit lines when the substrate is folded for packaging.
2Manufacturing precision
If the flexible substrate is made flat and linear, then the electric circuit lines can be printed clearly, but folding during use generates bending stress that damages the pattern
Solution Approach 1:
The substrate has different structural qualities in different regions: the main body remains flat for high-quality pattern printing, while a specific local region (the deformed portion) has modified properties to absorb bending stress. This allows the patterned areas to maintain manufacturing precision while the deformed portion handles the mechanical stress of folding.
Solution Approach 2:
The deformed portion acts as an intermediary element between the flat patterned regions and the folding action. It serves as a stress-absorbing zone that mediates the conflict between maintaining pattern integrity and accommodating the necessary folding for packaging and installation.
3Adaptability or versatility
If the substrate is folded for packaging constraints, then the product can be packaged, but the bending stress causes breaks or pinholes in the electric circuit lines
Solution Approach 1:
The substrate structure is made non-uniform with a deformed portion that has different mechanical properties. This local structural variation allows the substrate to be adapted for folding and packaging while the majority of the substrate, particularly the patterned regions, maintains its strength and integrity.
Solution Approach 2:
The deformed portion serves as a pre-prepared cushioning zone that absorbs the impact and stress of folding. By having this stress-absorbing region in place before packaging, the substrate can undergo the necessary folding operations without transmitting damaging forces to the electric circuit lines.
Data Source
AI summary
A flexible substrate includes a base substrate layer; and two patter layers laminated together on the front- and back-sides of the flexible substrate, on which electric circuit lines are printed each. In order to reduce a stress generated in the flexible substrate when it is folded and soldered to an optical communication semiconductor package, the flexible substrate has a thickness-wise concavely deformed portion in a lengthwise middle portion thereof. Also to reduce the stress, the flexible substrate having the deformed portion further has end sections and a middle section formed in its longitudinal direction, and the widths of the end sections are larger than that of the middle section, and the flexible substrate having the deformed portion further has holes and holes respectively formed near the side edges of a lengthwise middle section thereof.