Flexible Substrate Heat Dissipation in Display Devices

A resin layer is introduced as an intermediary between the driving IC and the thermally-conductive member. This resin layer has thermal conductivity of 0.3 W/m·K or more, enabling heat to be transmitted from the driving IC to the thermally-conductive member while preventing direct contact that would cause substrate deformation. The resin acts as a compliant interface that maintains thermal pathways without transmitting mechanical stress to the flexible substrate.

The thermal conductivity parameter of the intervening material is optimized. The resin layer is specified to have thermal conductivity of 0.3 W/m·K or more, which is sufficient for heat radiation while maintaining flexibility. This parameter change allows the material to function as both a thermal conduit and a stress-isolating layer, resolving the contradiction between heat dissipation and substrate protection.

The flexible substrate assembly is designed as a composite structure combining the flexible substrate, resin layer, and thermally-conductive member. The flexible substrate maintains its flexibility and heat radiation capability, while the resin layer provides thermal conductivity and the thermally-conductive member provides structural stability. This composite approach allows each layer to fulfill its specific function without compromising the others.

The heat radiation pathway is segmented into multiple functional layers: the flexible substrate for flexibility and initial heat dissipation, the resin layer for thermal conduction and stress isolation, and the thermally-conductive member for final heat sinking. This segmentation allows each component to be optimized independently for its specific function while working together as a unified thermal management system.