Flexible Substrate Electronic Stickers for Conformal IoT Integration
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Solution Overview
Problem
Conventional semiconductor manufacturing is limited by the need for rigid substrates, making it difficult to further reduce the size of electronic devices and adapt them to various applications, especially those without storage functionality.
Innovation Solution
The use of flexible substrates with layers such as inductive power coils, LEDs, wireless modules, sensors, and adhesive backing, manufactured using polymer on cellulose and 3D printing, allows for the creation of compact, versatile electronic devices like stickers that can be used for IoT applications, including lighting, sensing, and power charging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing is used with rigid substrates, then manufacturing precision and reliability are improved, but device size reduction and adaptability are limited
Solution Approach 1:
The patent replaces rigid silicon wafers with flexible substrates such as polyimide films, enabling the electronic devices to be bent, folded, or conformally mounted on curved surfaces. This flexible substrate supports thin-film transistor fabrication processes, allowing the device to achieve both manufacturing precision through controlled film deposition and adaptability through flexible form factors.
Solution Approach 2:
The patent transitions from planar rigid devices to three-dimensional flexible structures that can be stacked in layers or conformally wrapped around objects. By adding the dimension of flexibility and enabling spatial reconfiguration, the device maintains manufacturing precision while gaining adaptability to various mounting surfaces and applications.
2Productivity
If device size is reduced to eliminate storage space, then productivity and adaptability are improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the electronic device into functional layers (e.g., substrate layer, transistor layer, interconnect layer, encapsulation layer) that can be independently fabricated and then assembled. This segmentation allows each layer to be optimized for its specific function, reducing overall device complexity while maintaining high productivity through specialized manufacturing processes for each layer.
Solution Approach 2:
The patent designs the flexible electronic device to integrate multiple functions (computing, sensing, display, communication) within a single ultra-thin package. By making the substrate and interconnect structures universal and multi-functional, the device achieves high productivity without requiring separate components, thereby reducing overall complexity.
3Adaptability or versatility
If flexible substrates are used instead of rigid substrates, then adaptability and ease of manufacture are improved, but structural strength decreases
Solution Approach 1:
The patent employs composite substrate structures combining flexible polymers (e.g., polyimide) with supportive layers such as thin metal foils or cross-linked polymer networks. This composite construction provides the necessary mechanical strength and dimensional stability while maintaining the flexibility and adaptability required for conformal mounting and flexible form factors.
Solution Approach 2:
The patent implements a multi-layer encapsulation structure where flexible substrates are nested within protective encapsulation layers. This nested configuration provides mechanical strength and environmental protection to the flexible components while preserving their adaptability and flexibility for various mounting applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the development of ultrathin, cost-effective, and adaptable electronic stickers that can be easily integrated into various environments for IoT functions, providing flexible power solutions, lighting, and sensor capabilities without the need for rigid structures.
Implementation Method 1
at least one layer of the one or more layers may include an inductive power coil configured to receive power for operating the one or more electronic devices
Implementation Method 2
at least one layer of the one or more layers may include one or more light emitting diodes (LEDs)
Data Source
Figure 1~3
Figure 4
AI summary
Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.