Flexible Substrate Folding for Compact Sensor Package
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Solution Overview
Problem
There is a need for compact, low-profile packaging solutions for advanced sensor devices that integrate multiple sensors and processors, as conventional methods struggle to efficiently utilize space and provide both internal device integration and external interfacing features.
Innovation Solution
The development of an integrated device package with a flexible substrate that can be bent or folded, featuring a carrier with angled walls to create a 3D housing for multiple device dies, allowing for both internal integration and external interfacing features like capacitive touch sensors and antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple device dies are stacked on a package substrate to reduce footprint, then the package area is reduced, but the package profile height increases
Solution Approach 1:
The patent transitions from planar stacking (2D arrangement on substrate) to three-dimensional folding (adding vertical dimension through bends). The substrate is folded into multiple layers creating a compact 3D structure that reduces both footprint and profile height by utilizing spatial arrangement in multiple dimensions rather than simple vertical stacking
Solution Approach 2:
The patent implements nesting by placing device dies on different layers of the folded substrate, where inner layers contain additional dies within the volume defined by outer layers. This nested arrangement allows multiple dies to coexist in a compact volume, reducing overall package dimensions while maintaining high integration
2Productivity
If through silicon vias are used to provide vertical integration, then device integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the complex TSV manufacturing process and replaces it with a simpler substrate folding approach. Instead of creating vertical interconnections through silicon using complex via formation and filling processes, the invention uses mechanical folding of flexible substrate to achieve vertical integration, thereby maintaining high integration density while significantly reducing manufacturing complexity
Solution Approach 2:
The patent replaces the complex mechanical/chemical process of TSV formation with a simpler mechanical folding operation. The substrate folding mechanism substitutes for the multi-step TSV process, achieving similar vertical integration functionality through a more straightforward mechanical action that is easier to manufacture
3Volume of stationary object
If a compact low profile package is used to integrate sensor devices, then package volume is reduced, but external interfacing features become difficult to accommodate
Solution Approach 1:
The patent uses substrate folding to create multiple layers and surfaces within a compact volume. This dimensional transformation provides multiple exterior surfaces on different layers of the folded substrate, allowing external interfacing features to be accommodated on various faces of the compact package without increasing overall volume, thus maintaining both compactness and interfacing versatility
Data Source
AI summary
Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.