Flexible Substrate Gasket for EMI Shielding in Electronic Devices
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Solution Overview
Problem
The increasing speed of signal frequencies and downsizing of electronic devices make it challenging to effectively address electromagnetic interference (EMI) without increasing costs and manufacturing steps, as conventional EMI countermeasures like shielding materials are costly and difficult to accurately position.
Innovation Solution
The implementation of a flexible substrate with a conductive signal layer and a reinforcing layer that includes an opening for a gasket to connect the substrate to the housing, allowing for accurate positioning and conduction without additional EMI countermeasure components, thereby reducing EMI radiation and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI countermeasure components (shielding materials, conductors) are added to the electronic device, then EMI radiation is reduced, but the cost and manufacturing steps increase
Solution Approach 1:
The patent combines the grounding function and EMI shielding function into a single gasket structure. The gasket simultaneously provides electrical connection (grounding) and EMI radiation reduction, eliminating the need for separate EMI countermeasure components and reducing manufacturing complexity
Solution Approach 2:
The gasket is designed to perform multiple functions: it serves as both a grounding element (providing electrical connection between flexible substrate and housing) and an EMI shielding element (reducing electromagnetic radiation). This multi-functionality reduces the overall number of components needed
2Reliability
If a tabular gasket is interposed in a narrow space between conductor and housing, then grounding is improved and noise radiation is reduced, but the gasket position cannot be determined specifically
Solution Approach 1:
The gasket is equipped with positioning protrusions that fit into corresponding positioning recesses on the flexible substrate or housing before final assembly. This preliminary positioning action ensures the gasket is correctly positioned during assembly, eliminating positioning uncertainty
Solution Approach 2:
The positioning protrusions act as intermediaries between the gasket and the flexible substrate/housing, providing a mechanical interface that ensures precise positioning. These protrusions guide the gasket into the correct position during assembly
3Reliability
If the conductor is provided on the surface of the flexible substrate, then electrical connection is achieved, but the gasket is likely to move and its position cannot be determined
Solution Approach 1:
Positioning protrusions are pre-formed on the gasket to engage with corresponding features on the flexible substrate or housing before final assembly. This preliminary action secures the gasket in the correct position, preventing movement during assembly and use
Solution Approach 2:
The gasket features asymmetric positioning protrusions that fit into specific asymmetric recesses or slots on the flexible substrate. This asymmetric design ensures the gasket can only be positioned in one specific orientation, preventing movement and ensuring stable positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces EMI radiation and simplifies the manufacturing process by ensuring accurate positioning of the gasket and eliminating the need for additional EMI countermeasures, resulting in a cost-effective and efficient EMI mitigation strategy.
Implementation Method 1
A conductor is inserted from the opening and connected to the signal layer exposed at the portion of the second surface, thereby connecting the signal layer to the housing
Data Source
AI summary
According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing.