Flexible Substrate With Heat-Dissipating Metal Layer

The patent applies composite materials by combining a flexible substrate with a heat-dissipating structure comprising multiple metal layers (nickel-chromium alloy layer, first copper layer, and second copper layer). This composite structure integrates the flexibility of the substrate with the high thermal conductivity of metals, enabling effective heat dissipation while maintaining flexibility. The multi-layer composite design specifically addresses the contradiction by layering materials with different properties to achieve both thermal management and mechanical flexibility.

The patent employs flexible shells and thin films by using a thin flexible substrate as the base and depositing metal layers in a thin-film configuration. This approach enables heat dissipation functionality while maintaining the overall thin and flexible profile of the substrate. The thin-film metal layers provide high thermal conductivity without significantly increasing the overall thickness or structural complexity, thus resolving the contradiction between heat dissipation efficiency and device complexity.

The patent applies parameter changes by carefully controlling the thickness, material composition, and thermal conductivity parameters of each metal layer. The nickel-chromium alloy layer provides oxidation resistance with specific thermal properties, while the copper layers are optimized for maximum thermal conductivity. By precisely controlling these parameters, the patent achieves high thermal efficiency while maintaining manufacturability through standardized deposition processes and well-defined material specifications.