Flexible Substrate IC Package with Recessed Encapsulation

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Solution Overview

Problem

Current electronics packaging technologies face challenges in accommodating high-speed computer devices, particularly in terms of cooling, reliability, and cost-effectiveness, with increasing complexity and risk of errors during manufacture, while struggling to meet the demands of next-generation portable electronics that require smaller footprints and more robust packages.

Innovation Solution

An integrated circuit package system utilizing a flexible circuit substrate with folds, mounted integrated circuits, and a recessed encapsulation with distinct levels, providing enhanced interconnects and thermal management through a flexible substrate that wraps around the molding compound, supporting higher integration and reduced thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If current packaging technologies are used for high-speed computer devices, then device functionality is maintained, but thermal management becomes inadequate and reliability decreases

Engineering Contradiction:

Improvethermal managementVSAvoiddevice reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent implements a multi-level nested encapsulation structure where a first encapsulation material surrounds the semiconductor die, and a second encapsulation material surrounds the first encapsulation, creating concentric protective layers that improve thermal management and device reliability through progressive shielding and heat dissipation pathways

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent employs composite encapsulation structures combining different materials (first encapsulation material and second encapsulation material with distinct properties) to simultaneously address thermal management requirements and reliability concerns, leveraging the complementary characteristics of each material layer

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If package complexity is increased to meet next-generation device requirements, then device performance improves, but manufacturing error risk increases

Engineering Contradiction:

Improvepackage adaptabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the encapsulation system into distinct segments (first encapsulation material, second encapsulation material, flexible substrate layers) that can be independently processed and assembled, allowing complex functionality to be achieved through modular construction that reduces manufacturing error risk

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flexible substrate serves as an intermediary element that connects the semiconductor die to the external environment, providing a standardized interface that simplifies manufacturing while enabling adaptability for different device configurations through its flexibility and reconfigurable contact patterns

Inventive Principle:

Principle #24Intermediary (Mediator)

3Weight of moving object

If portable electronics are made smaller, then device portability improves, but package footprint reduction becomes challenging

Engineering Contradiction:

Improvedevice weightVSAvoidpackage footprint

Core Design Contradiction:

Weight of moving objectVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar package layout to a three-dimensional stacked architecture where the flexible substrate is folded back underneath the device, utilizing the vertical dimension to reduce the horizontal footprint while maintaining all necessary electrical connections and structural support

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a flexible substrate that can be folded and conformally shaped to wrap around the device edges, creating a compact profile that reduces both footprint and thickness while maintaining structural integrity and electrical connectivity through the flexible circuit traces

Inventive Principle:

Principle #30Flexible shells and thin films

4Productivity

If production time is reduced to meet market demands, then manufacturing efficiency improves, but manufacturing precision may deteriorate

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidassembly precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent incorporates pre-formed encapsulation materials and pre-configured flexible substrate structures that are prepared in advance with integrated features (such as pre-formed contact patterns and pre-cured encapsulation layers), eliminating time-consuming assembly steps while maintaining precision through the pre-established geometric relationships

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8050047B2Integrated circuit package system with flexible substrate and recessed package

Publication Date: 2011.11.01 STATS CHIPPAC LTD

AI summary

An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.