Flexible Substrate Image Sensor Module for EMI Shielding and Thickness Reduction
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Solution Overview
Problem
Existing image-sensing modules face challenges in reducing overall thickness due to the large hard substrate and limited space for electronic elements, which also hinders the integration into portable devices and increases susceptibility to electromagnetic interference.
Innovation Solution
The use of a flexible substrate with a first and second PCB, where the image sensor is exposed through a first opening, allowing the electronic elements to be disposed between the PCBs, reducing thickness and preventing electromagnetic interference by forming metal shields and using insulative adhesive layers to manage signal transmission efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a hard substrate is used to support electronic elements, then the structural stability is improved, but the overall thickness of the image-sensing module increases
Solution Approach 1:
The patent replaces the traditional hard substrate with a flexible substrate that can be bent into a U-shape configuration. This flexible substrate maintains structural stability while enabling a compact folded layout, thereby reducing the overall thickness of the image-sensing module without compromising the support function for electronic elements.
Solution Approach 2:
The patent transforms the flat two-dimensional substrate into a three-dimensional U-shaped folded structure. By bending the flexible substrate into a U-shape with a bending portion, the electronic elements can be arranged in a folded configuration, achieving compact integration and reduced thickness while maintaining structural integrity.
2Device complexity
If all electronic elements are disposed on a single hard substrate, then the electrical connection is simplified, but the available space for signal transmission paths is reduced
Solution Approach 1:
The patent divides the substrate into multiple functional regions: a first substrate portion, a bending portion, and a second substrate portion. Electronic elements are selectively disposed on different portions, with the LDO regulator on the first substrate portion and the backend IC on the second substrate portion. This segmentation creates dedicated signal transmission paths and improves spatial arrangement while maintaining electrical connection simplicity through the continuous flexible substrate.
3Object-affected harmful factors
If an anti-EMI element is added to protect electronic elements, then the electromagnetic interference protection is improved, but the overall thickness increases
Solution Approach 1:
The patent integrates EMI protection functionality directly into the flexible substrate structure itself, rather than adding a separate anti-EMI element layer. The flexible substrate is designed with embedded EMI shielding properties, combining the substrate function and EMI protection function into a single integrated component, thereby achieving electromagnetic interference protection without increasing overall thickness.
Solution Approach 2:
The flexible substrate serves dual functions as both the structural support and the EMI protection layer. By incorporating EMI shielding capabilities into the flexible substrate material or structure, the patent eliminates the need for additional thick anti-EMI elements while maintaining protection against electromagnetic interference.
Data Source
AI summary
An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.