Flexible Substrate Imaging Module for Endoscope Size Reduction
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Solution Overview
Problem
Conventional imaging modules for endoscopic devices face challenges in achieving high-quality image processing and compact design due to the limitations of signal processing speed and module size, particularly in the arrangement and connection of imaging and signal processing units.
Innovation Solution
The imaging module incorporates a flexible substrate with a bendable insulating film, allowing the imaging and signal processing units to be mounted on the same surface, with parallel processing capabilities for each pixel column, and arranged in a configuration that maintains a compact shape while preventing signal deterioration, using a CMOS image sensor and signal processing chip with specific circuitry for efficient image capture and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the imaging unit and signal processing unit are connected by a micro-bump on a rigid substrate, then the processing speed is enhanced and all pixels can be driven simultaneously, but the module size increases and flexibility is reduced
Solution Approach 1:
The patent uses a flexible substrate with a thin film structure to connect the imaging unit and signal processing unit. This flexible substrate allows the module to be bent and reduces the overall module size while maintaining the micro-bump connection for high-speed signal processing. The flexible nature enables compact arrangement without sacrificing processing speed.
Solution Approach 2:
The patent arranges the imaging unit and signal processing unit in a three-dimensional configuration by bending the flexible substrate, allowing them to be positioned at different spatial levels. This dimensional arrangement reduces the planar footprint of the module while maintaining effective electrical connections through the flexible substrate.
2Ease of manufacture
If the imaging unit and signal processing unit are mounted on the same surface, then the mounting process is simplified, but signal deterioration may occur due to longer signal paths
Solution Approach 1:
The flexible substrate acts as an intermediary between the imaging unit and signal processing unit, providing optimized signal pathways. The substrate is designed with specific trace routing that minimizes signal deterioration while enabling both units to be mounted on the same base structure, simplifying the manufacturing process.
Solution Approach 2:
The patent optimizes the electrical parameters of the flexible substrate, such as trace width, material conductivity, and trace length, to minimize signal deterioration. By carefully controlling these parameters, the substrate maintains signal integrity even when connecting units mounted on the same surface.
3Manufacturing precision
If parallel processing is implemented for each pixel column, then image quality is improved, but the device complexity increases
Solution Approach 1:
The signal processing unit is segmented into multiple parallel processing channels, with each channel dedicated to processing signals from a specific pixel column. This segmentation enables simultaneous parallel processing of multiple columns, improving image quality while organizing the complexity into manageable, modular units.
Solution Approach 2:
The patent designs universal processing circuits that can handle multiple functions within each pixel column processing channel. These multi-functional circuits perform various signal processing operations (amplification, analog-to-digital conversion, noise filtering) in a single integrated unit, reducing overall device complexity while maintaining parallel processing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-quality image capture and processing while realizing a smaller, more efficient imaging module with reduced signal deterioration and simplified mounting, enhancing the imaging capabilities of endoscopic devices.
Implementation Method 1
an imaging device such as a CCD image sensor or a CMOS image sensor for generating image data of a subject by performing photoelectric conversion on light with which the optical system forms the image
Data Source
AI summary
An imaging module includes: an imaging unit including a light receiving unit having a plurality of pixels arranged in a specified shape including a lattice shape and configured to receive light and to perform photoelectric conversion on the received light, the imaging unit being configured to capture an image of a subject and to output the image as a light quantity signal; a signal processing unit configured to perform signal processing on the light quantity signal; and a flexible substrate which includes a bendable insulating film and on which the imaging unit and the signal processing unit are mounted. The flexible substrate is bent to arrange the signal processing unit and the flexible substrate in a space extending from an outer edge of an incident surface of the imaging unit in a direction perpendicular to the incident surface while maintaining a shape of the outer edge.