Flexible Substrate Circuit Patterns via Imprinting
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Solution Overview
Problem
Conventional methods for manufacturing flexible substrates for semiconductor packages, such as LCD driving integrated circuit (LDI) devices, face inefficiencies and low yield due to complex processes and the need for photolithography, which increases costs and defects.
Innovation Solution
A flexible substrate manufacturing method that forms a circuit pattern using an imprinting process without photolithography, employing a metallic pattern with a dented shape on an insulating substrate, followed by curing and plating, to simplify the process, reduce defects, and enhance productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form circuit patterns on flexible substrates, then manufacturing precision can be achieved, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent extracts and removes the photolithography step from the manufacturing process. Instead of using complex photolithography to form circuit patterns, the invention directly forms metal patterns on the flexible substrate through simplified deposition and etching processes, thereby eliminating the source of complexity while maintaining pattern precision
Solution Approach 2:
The patent replaces the optical-mechanical photolithography system with a direct physical deposition and etching system. Metal patterns are formed through physical vapor deposition or electroplating followed by simple etching, substituting the complex optical alignment and chemical development processes of photolithography with more straightforward physical processes
2Manufacturing precision
If conventional multi-step processes are used for flexible substrate manufacturing, then circuit patterns can be formed, but productivity decreases and manufacturing time increases
Solution Approach 1:
The patent merges multiple separate manufacturing steps into integrated processes. The circuit pattern formation is combined with the flexible substrate fabrication in a unified process flow, where metal patterns are deposited and etched directly on the flexible substrate without separate photolithography stages, thereby reducing total process time and improving productivity
Solution Approach 2:
The patent performs preliminary formation of the flexible substrate with integrated circuit pattern regions before final metal deposition. The substrate is prepared with pre-defined pattern areas through imprinting or direct writing techniques, so that subsequent metal deposition directly creates the final circuit patterns without requiring additional patterning steps
3Manufacturing precision
If photolithography processes are employed, then circuit patterns can be created, but manufacturing cost and defect rate increase
Solution Approach 1:
The patent extracts the photolithography step that serves as a major source of defects. By eliminating the multiple coating, exposure, and development steps of photolithography, the invention removes potential failure points such as photoresist contamination, exposure uniformity issues, and development defects, thereby improving yield rate while maintaining pattern creation capability
Solution Approach 2:
The patent replaces expensive and complex photolithography materials (photoresists, alignment marks, photomasks) with simpler, more durable metal deposition and etching processes. The direct physical deposition methods use robust materials that are less prone to degradation and contamination, reducing both cost and defect rates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the semiconductor manufacturing process, increases yield, reduces manufacturing costs, and improves the reliability of the flexible substrate by eliminating the need for photolithography and allowing for finer line widths and improved adhesion.
Implementation Method 1
a polymer solution 12 which may be coated on a casting plate 10 and dried, a solvent of the polymer solution 12 which may be evaporated
Implementation Method 2
the polymer solution 12 which may be thermally treated and cured
Implementation Method 3
cross-linking, which may be performed on the insulating substrate 12, which may increase the density of the insulating substrate 12
Implementation Method 4
The seed layer 14 may be formed by sputtering
Implementation Method 5
electrolytic plating may be performed on the insulating substrate 12 on which the seed layer 14 may be formed, thereby forming the copper plate layer 16 on the seed layer 14
Data Source
AI summary
A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern formed of a metallic material is formed in the circuit pattern forming region.