Flexible Substrate Integrated Circuit Routing for Bending Freedom
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Solution Overview
Problem
Flexible electronic devices face limitations in structural strength and degree of freedom in bending due to the rigidity of printed circuit boards and weak junctions between flexible and printed circuit boards.
Innovation Solution
A flexible electronic device design featuring a first flexible substrate with an integrated conductive layer and circuit layer set, where the conductive layer and circuit layers are integrally formed and disposed on the substrate, allowing for electrical connection of integrated circuits directly to the electronic component without relying on a printed circuit board or flexible printed circuit board, enhancing structural strength and bending flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a printed circuit board is used to control the display panel, then the control function is achieved, but the flexibility and bending freedom are limited
Solution Approach 1:
The patent merges the control device with the flexible substrate by directly fabricating the control device on the flexible substrate. This integration eliminates the need for separate rigid PCB and FPCB components, allowing the display panel to be controlled while maintaining full flexibility and bending freedom of the flexible substrate.
Solution Approach 2:
The patent uses a flexible substrate as the base for the control device, replacing traditional rigid PCB structures. The flexible substrate enables the control device to bend and flex without structural damage, achieving both control functionality and bending freedom simultaneously.
2Ease of operation
If a flexible printed circuit board is used to connect components, then flexibility is improved, but the junction strength becomes weak
Solution Approach 1:
The patent eliminates the need for FPCB connections by integrating the control device directly on the flexible substrate. This removes the weak junction points between FPCB and other components, while maintaining flexibility through the unified flexible structure.
Solution Approach 2:
The patent extracts and removes the FPCB component from the system by directly fabricating control circuits on the flexible substrate. This elimination of the intermediate FPCB layer removes the source of weak junctions while preserving the desired flexibility.
Data Source
AI summary
A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.