Flexible Display Substrate Interweaved Structure for Bonding Strength

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Solution Overview

Problem

Flexible display panels face issues with poor bonding strength between fluorinated transparent polyimide and rigid glass substrates, leading to warpage and compatibility problems, and the double-layered polyimide structure experiences inertia and separation risks during the laser lift-off process.

Innovation Solution

A flexible display device substrate with an interweaved structure layer formed by partially penetrating and weaving the first and second flexible substrates, along with a toughening layer disposed alternately, enhances bonding strength and reduces interface inertia, using a preparation method involving incompletely cured polyamic acid solutions that interweave and cure to form a robust polyimide substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If fluorinated transparent polyimide is used as the flexible substrate, then transparency and flexibility are improved, but bonding strength with rigid glass substrate deteriorates

Engineering Contradiction:
ImprovetransparencyVSAvoidbonding strength
Core Design Contradiction:
Illumination intensityVSStrength

Solution Approach 1:

The flexible substrate is segmented into two separate polyimide layers (first and second flexible substrates) connected by an interweaved structure layer, allowing each layer to be optimized for transparency while the interweaved structure provides enhanced bonding capability with the rigid substrate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interweaved structure layer is formed by weaving together fibers from the first and second flexible substrates, creating a composite structure that combines the transparency of polyimide with the bonding strength of the interlaced fiber network

Inventive Principle:
Principle #40Composite materials

2Productivity

If double-layered transparent polyimide structure is introduced with sacrificial layer, then product yield is improved, but interface inertia and separation risk increase

Engineering Contradiction:
Improveproduct yieldVSAvoidbonding reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The first and second flexible substrates are merged through an interweaved structure layer where fibers from both substrates are woven together, creating a unified structure that eliminates interface inertia and prevents separation during laser lift-off

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The interweaved structure layer provides localized reinforcement at the interface between the two flexible substrates, with the woven fiber pattern creating areas of enhanced bonding strength exactly where needed to prevent separation

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves warpage and bonding issues, reduces damage and fragmentation risks during the laser lift-off process, and enhances product yield and quality by increasing bonding strength between substrates and maintaining transparency.

Implementation Method 1

a first flexible substrate, a second flexible substrate disposed on the first flexible substrate

Methodology Applied
Scientific EffectCuring: Phase Change

Data Source

PatentUS11670639B2Flexible display substrate and preparation method thereof
Publication Date: 2023.06.06 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US11670639B2 patent drawing
  • US11670639B2 patent drawing
  • US11670639B2 patent drawing

AI summary

A flexible display device substrate and a preparation method thereof are provided. The flexible display device substrate includes a first flexible substrate, a toughening layer, a second flexible substrate, and an interweaved structure layer. The second flexible substrate is disposed on the first flexible substrate. The interweaving structure layer is disposed between the first flexible substrate and the second flexible substrate, wherein the interweaving structure layer is formed by a part of the first flexible substrate and a part of the second flexible substrate penetrating and interweaving with each other. The toughening layer is disposed at intervals between the first flexible substrate and the second flexible substrate, and the toughening layer and the interweaved structure layer are disposed alternately.