Flexible Substrate Junction Structure with Elastic Bending
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Solution Overview
Problem
Existing junction structures of substrates joined with solder face issues with unstable positioning, poor workability, and increased complexity due to height differences and orthogonal joint configurations, leading to difficulties in applying solder and maintaining joint stability.
Innovation Solution
A junction structure where a first joint on one substrate and a second joint on another substrate with elasticity are joined using a bending mechanism, where the second joint is directed outward and the first joint is brought into contact to resist the elastic force, ensuring stable positioning and improved workability during soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If substrates are arranged in parallel with overlapping metal foil portions for joining, then the joining structure is simple, but the relative positions of metal foil portions may be displaced resulting in unstable positioning
Solution Approach 1:
A holding member is introduced as an intermediary component to hold the flexible substrate during joining. The holding member includes positioning protrusions that fit into positioning holes, providing stable positioning without complicating the overall joining structure. This mediator resolves the conflict between simplicity and positioning stability.
2Manufacturing precision
If substrates are arranged orthogonally for joining, then positioning may be improved, but it becomes difficult to visually check joints and apply heat simultaneously reducing workability
Solution Approach 1:
The holding member extends in a direction substantially perpendicular to the flexible substrate, creating a third dimension for positioning. The positioning protrusions extend from the holding member in a direction substantially parallel to the substrate surface, allowing accurate positioning while maintaining good visual access and heat application from above.
3Reliability
If comb-teeth portions and holes are formed for joining flexible printed circuit boards, then joining stability is improved, but the degree of difficulty in working increases and price rises
Solution Approach 1:
The positioning function is extracted from the flexible printed circuit boards themselves and transferred to a separate holding member. Instead of forming complex comb-teeth portions and holes in the FPCBs, simple positioning holes are formed in the holding member, significantly reducing manufacturing difficulty while maintaining joining stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the joining process, reduces the risk of solder separation, and enhances workability by allowing for easier application of solder and heat application, while maintaining flexibility in wiring designs and reducing manufacturing costs.
Implementation Method 1
the second substrate is bent and exhibits an elastic force generated in a direction that reduces the degree of bending
Implementation Method 2
The first joint and second joint are joined with a joining material such as solder
Implementation Method 3
solder melted during joining
Data Source
AI summary
A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.