Flexible Substrate Fabrication via Laser Separation
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Solution Overview
Problem
Existing flexible display device fabrication processes are complex and prone to deformation due to the use of glass substrates, which are brittle and lack flexibility, and alternative methods using plastic or metal foils face issues with overcoat layer formation, etching, and adhesive separation, leading to structural weaknesses and increased costs.
Innovation Solution
A multi-layered flexible substrate is formed on a glass substrate, comprising a semiconductor layer, a first flexible layer, an adhesive layer, and a second flexible layer, which enhances strength and durability, allowing for the separation of the glass substrate using laser irradiation without physical force, thus simplifying the fabrication process and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass substrates are used to support thin films in flat display devices, then structural support is provided, but durability and flexibility are reduced
Solution Approach 1:
The substrate is divided into two separate components: a glass substrate providing structural support and a flexible substrate providing flexibility and durability. This segmentation allows each component to fulfill its specific function without compromising the other, resolving the contradiction between structural support and flexibility.
Solution Approach 2:
The invention uses a composite structure combining glass substrate and flexible substrate materials. This composite approach allows the system to exhibit both the structural properties of glass and the flexibility/durability of flexible materials, simultaneously achieving strength and reliability.
2Shape
If an overcoat layer is applied to flatten the flexible substrate and then the back side is etched, then substrate flatness is improved, but the fabrication process becomes complicated
Solution Approach 1:
The flexible substrate is prepared in advance with a flattened configuration before the main fabrication process. This preliminary flattening action eliminates the need for subsequent overcoat application and etching steps, simplifying the overall fabrication process while maintaining substrate flatness.
3Ease of manufacture
If adhesive is used to form the flexible substrate on glass, then substrate formation is achieved, but the flexible substrate bends in separation direction when adhesive is separated
Solution Approach 1:
A release layer is introduced as an intermediary between the adhesive and the flexible substrate. This release layer allows for easy separation without causing substrate deformation, as it provides a controlled separation interface that prevents the substrate from bending in the separation direction.
4Ease of manufacture
If spin coating is used to coat plastic thin film on glass substrate, then flexible substrate formation is achieved, but protective film is required and pad portion cannot be protected
Solution Approach 1:
The invention applies different properties to different regions of the substrate. The pad portion is given enhanced protection through localized reinforcement or protective coating, while other regions maintain their original properties. This local quality differentiation allows pad portion protection without requiring a complete protective film overlay.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered flexible substrate improves the structural integrity of the display device, reduces moisture and oxygen infiltration, extends the device's lifetime, and simplifies the fabrication process by eliminating the need for protective films and reducing costs associated with waterproof adhesives.
Implementation Method 1
allowing for the separation of the glass substrate using laser irradiation without physical force
Data Source
AI summary
A method for fabricating a flexible display device including the steps of preparing a glass substrate, forming a flexible substrate on the glass substrate, the flexible substrate being formed by forming a semiconductor layer on the glass substrate, forming a first flexible layer on the semiconductor layer, forming an adhesive layer on the first flexible layer, and forming a second flexible layer on the adhesive layer, forming a thin film array on the flexible substrate, forming a display device on the thin film array, and separating the glass substrate from the semiconductor layer of the flexible substrate.