Flexible Substrate LED Lighting for Heat Dissipation and Robustness
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Solution Overview
Problem
Existing LED technologies face challenges in heat dissipation, appearance, and robustness when attempting to replace traditional filament light bulbs, particularly for decorative purposes, requiring a cost-effective solution that addresses these issues.
Innovation Solution
A lighting apparatus comprising a light module with dual LED chip layers, a driver for power conversion, and a wireless circuit for control, allowing for flexible power supply and remote adjustment of light parameters, along with a modular design that enables easy replacement of wireless modules for different functions and protocols, and a flexible substrate for improved heat management and aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED technology is applied to filament light bulbs, then luminous efficacy is improved, but heat dissipation and appearance are worsened
Solution Approach 1:
The patent extracts the LED chips from the traditional filament bulb structure and places them on a flexible substrate, separating the light generation function from the heat generation problem. The flexible substrate acts as a thermal management medium that can be shaped to optimize heat dissipation while maintaining the aesthetic appearance of a filament bulb.
Solution Approach 2:
The patent uses a flexible substrate as a thin film structure to mount LED chips, replacing the rigid traditional bulb structure. This flexible substrate can be shaped to conform to different bulb forms, maintaining aesthetic appearance while providing a controlled environment for heat dissipation and electrical connections.
2Use of energy by moving object
If LED technology is applied to filament light bulbs, then luminous efficacy is improved, but appearance and robustness are worsened
Solution Approach 1:
The flexible substrate provides a robust platform for mounting LED chips, protecting them from mechanical damage while maintaining the aesthetic appearance. The substrate's flexibility allows it to withstand handling and installation stresses without cracking or deforming, improving overall robustness.
Solution Approach 2:
The patent uses composite material structures combining the flexible substrate with LED chips and electrical components. This composite approach creates a robust assembly that integrates multiple functions (light generation, electrical connection, thermal management, and structural support) into a single reliable unit.
3Adaptability or versatility
If wireless circuit is integrated into light module, then adaptability is improved, but device complexity is worsened
Solution Approach 1:
The patent segments the wireless circuit into a separate, modular component that can be independently designed, tested, and replaced. This segmentation allows the wireless functionality to be added without redesigning the entire light module, reducing overall complexity while maintaining adaptability.
Solution Approach 2:
The wireless circuit is designed with universal interfaces and protocols that allow it to work with different light module configurations and control systems. This universality enables the same wireless circuit to serve multiple functions and adapt to various applications without requiring custom designs for each use case.
4Adaptability or versatility
If dual LED chip layers are used, then adaptability for different optical parameters is improved, but device complexity is worsened
Solution Approach 1:
The patent segments the LED chips into two distinct layers with different optical characteristics, allowing independent control and optimization of each layer. This segmentation enables precise control over the overall optical output by adjusting individual layers, achieving diverse optical parameters without requiring a completely complex integrated structure.
Solution Approach 2:
Each LED chip layer is designed with specific local qualities - different chip types, orientations, or optical characteristics - to achieve particular optical effects. By assigning different properties to different layers, the patent achieves high adaptability for optical parameter control while keeping each individual layer relatively simple in design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and flexible LED lighting system that effectively addresses heat dissipation, appearance, and robustness concerns, enabling efficient and customizable lighting solutions for various applications, including decorative uses, while maintaining high luminous efficacy.
Implementation Method 1
the driver converts an alternating current of 110V/220V to a DC current for driving LED (Light Emitted Diode) components
Implementation Method 2
a first LED chip layer includes multiple LED chips and the second LED chip includes multiple LED chips
Data Source
AI summary
A lighting apparatus includes an elongated light strip, a bracket and a driver. The elongated light strip includes a flexible substrate, a first color band, a second color band and a third color band. The first color band, the second color band and the third color band are arranged in parallel on the flexible substrate. The bracket is used for supporting and bending the elongated light strip. The driver is connected to the first color band, the second color band and the third color band to emit a light of a required light parameter.